Industry Directory | Manufacturer
exerra raises standards of performance and usability in screen printing for the electronics assembly industry.
~1485G-P6N5-C 1485G-P6N5-M5 1485G-P6R5-C 1485G-P6R5-D5 1485GF-P1N5-M5 1485GF-P2N5-M5 1485GF-P3N5-M5 1485GF-P4N5-M5 1485GF-P5N5-M5 1485GF-P6N5-M5 1485K-P1F5-C 1485K-P1F5-N5 1485K-P1F5-R5 1485K-P1F5-V5 1485K-P1F5-Z5 1485K-P1FD5-D5 1485K
Electronics Forum | Mon Jan 17 07:48:37 EST 2011 | davef
SMTnet Newsletter Aug 1999 by B Ellis Title: A Comprehensive Guide to the Design and Manufacture of Printed Board Assemblies Vol. 1 & 2 Editor: William Macleod Ross Publisher: Electrochemical Publications Limited, GB This two-volume work can p
Used SMT Equipment | Pick and Place/Feeders
SIEMENS S20 Chip Shooter D.O.M.:1998 S/N:876-9696 Nozzel Changer L-R single Conveyor; rated at 20;000 cph; two gantry's; twin 12 star heads; Includes two trolly's. Location:Atlanta; GA Machine being auctioned off May 15th - 17th at the following li
Used SMT Equipment | Screen Printers
MPM ULTRAPRINT 2000 Screen Printer S/N:20474 Pro Head; 2D inspection; understencil cleaner; auto paste dispense; tactile height sensor; Misc. board support tooling; Misc sets of squeegee blade assemblies included; stencil paper rolls Machine being
Industry News | 2007-06-08 12:55:27.0
Exerra, the innovative engineering technology and electronics assembly systems manufacturer based in Israel, has appointed SMT industry veteran Don Beard as Engineering Manager for North America.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
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