Electronics Forum | Tue Jan 17 21:40:08 EST 2012 | gaz
I'm testing SN100C, and with our 5 zone oven I seem to be able to fix one issue by changing the profile, but that might introduce a new problem. Some profiles work very well on most components, but have issues on other components. These are usually 0
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Industry News | 2020-05-18 13:26:01.0
MIRTEC is pleased to announce that Integrated Test Corporation, a leading fabricator of ATE probe and final test PCBs, has selected MIRTEC as their 3D AOI partner with the purchase of an MV-7U OMNI Large Format PCB 3D AOI Machine.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
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