Electronics Forum | Thu Jan 03 17:30:27 EST 2008 | davef
Consider conductive epoxy. Among the suppliers that make the stuff are: * Master Bond [154 Hobart St, Hackensack, NJ 07601; 201-343-8983 F201-343-2132 http://www.masterbond.com] * Chomerics [Parker Hannifin, 77 Dragon Ct, Woburn, MA 01801; 781-935-4
Electronics Forum | Tue Apr 22 08:55:54 EDT 2014 | davef
I assume that you're talking about wanting to solder to metal tabs that are spot welded to the battery terminal. These tabs are not meant to be soldered. The metal was special selected for welding. In the old days, you could buy plumbing flux at th
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
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