Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Tue Apr 23 14:30:35 EDT 2019 | scotceltic
I would like to setup a guideline for BGA to components around it minimum distance. To allow for rework possibilities of the BGA. What are people using as a minimum clearance out there ?
Electronics Forum | Thu Apr 25 08:57:55 EDT 2019 | scotceltic
Interesting. Makes it easier on design.
Used SMT Equipment | Repair/Rework
Sierra 1800 BGA Rework Stations (2 stations Available) Vintage: 2011 Both Systems running Windows-Based Sierra Mate SW Version 8.3.9. Advanced Auto Profile, Programmable Pick and Place Force with Component Height Sensing, Independent Top Heater and
Industry News | 2011-01-12 15:27:11.0
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.
Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer: 11912706 SPACER 40000630 SLIDE SPACER NUT 40001285 GUIDE SPACER 40001286 ATC SPACER RUBBER 40001288 SPACER NC 40001289 SPA
Parts & Supplies | Pick and Place/Feeders
JUKI E2119723000 PACKING A FUJINTAI TECHNOLOGY CO.,LTD JUKI E2119729000 SHAFT XM www.fujintai.com JUKI E2119755000 PLATE NUT FUJINTAI TECHNOLOGY CO.,LTD JUKI E2119998000 "JIG, ATC OFFSET BOSS (25) V010" www.fujintai.com JUKI E2120700000 PULLE
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
Career Center | , | Engineering
Job description This position is for a Mechanical Engineer involved in supporting, developing, and improving microelectronics manufacturing processes to optimize Quality, On-Time Delivery, and Cost with an emphasis on Safety. Implementation of Lean M
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
(Flex) BGA Using a Polyimide Tape Substrate Trent
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/ultralow.pdf
. The prototype Ultralow II shown at Nepcon ’99 has a standard clearance of .5" or 13mm above and below the edgehold pin and a maximum board width of 12.2"or 310mm (PHOTO 1
| http://etasmt.com/cc?ID=te_news_bulletin,23762&url=_print
. The prototype Ultralow II shown at Nepcon ’99 has a standard clearance of .5" or 13mm above and below the edgehold pin and a maximum board width of 12.2"or 310mm
