Electronics Forum: escape rate (15)

AOI False call rate vs defect rate PPM

Electronics Forum | Fri Jun 07 14:05:39 EDT 2024 | davidk

I wanted to open a discussion and ask about opinion: What is a normal result of the inspection of an AOI? How many falls calls per component /opportunity is bad/normal/good? How many defects per component/opportunity is bad/normal/good? What is goo

AOI False call rate vs defect rate PPM

Electronics Forum | Wed Jun 19 14:40:58 EDT 2024 | davidk

Hello Carl, Thank you for your comment Obviously, we are evolving and debugging our test to get the best results ("no escapes no false calls") :) and using a combination of 3D and 2D tests. With the previous AOI, we had a much higher false call rate,

Used SMT Equipment: escape rate (1)

PARMI Xceed

PARMI Xceed

Used SMT Equipment | AOI / Automated Optical Inspection

Eceed PARMI 3D AOI  High speed 3D AOI platform Equipped with innovative colour textured 3D sensor Shorten teaching time by virtue of smart algorithm Easy to use simple & intuitive GUI Extremely low false call and escape

INSPECTION TECH

Industry News: escape rate (30)

NEMI's Test Strategy Project Releases Cost Model

Industry News | 2003-05-22 08:54:17.0

Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies

SMTnet

Nordson DAGE’s Evstatin Krastev, Ph.D. to present at SMTA International 20132D/3D X-Ray Inspection: Process Control and Development Tool technical paper to be discussed

Industry News | 2013-09-16 14:19:30.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is delighted to announce that Evstatin Krastev, Ph.D., partnered with Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger and Murad Kurwa of FLEXTRONICS International Inc., and Zohair Mehkri of Santa Clara University, will be presenting their paper titled, “2D/3D X-Ray Inspection: Process Control and Development Tool” during technical session PRC2 Imaging, Inspection and Quality at the upcoming SMTA International in Fort Worth Texas.

Nordson DAGE

Technical Library: escape rate (1)

Orbotech Trion 2340 Manual

Technical Library | 2020-10-30 10:27:39.0

Preview of the Complete Aneryn's Orbotech Trion 2340 Manual. It explains how to programme the AOI machine, how to train new components (shapes), how to connect it to your network, among other processes. Following the Guide, you will minimize false alarms and escapes rates easily. Full Manual available at https://aneryn.com/creation/trion-2340-manual/ Digital development by Sinfonía Digital

Aneryn

Events Calendar: escape rate (1)

Corrosion Testing For Electronic Equipment

Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Tue Feb 18 00:00:00 EST 2020 | ,

Corrosion Testing For Electronic Equipment

CALCE Center for Advanced Life Cycle Engineering

Career Center - Resumes: escape rate (1)

smt technicina

Career Center | chennai, India | Engineering,Maintenance

Nokia India Pvt LTD.       Sriperumpudur – Board Assembler Maintenance Technician  from Sep 2009 to till now. Machines Handled  Pick & Place     : FUJI NXT Machines  FUJI NXT - M3 II ,M3S.  Reflow oven: Hot flow 3/20, 2/14.  Stencil Pr

Express Newsletter: escape rate (176)

Partner Websites: escape rate (19)

Battery Cell Bonding Applications | Nordson Sealant Equipment

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/solutions/battery-cell-bonding-applications

: Programmable dispense speeds allow for mid-shot adjustments in material flow rate, which allows air to escape from the fill. Speed can be adjusted back to full speed once the material is past the point of concern, which allows production speed to be achieved

ASYMTEK Products | Nordson Electronics Solutions

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf

) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down

Heller Industries Inc.


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