Electronics Forum | Fri Dec 10 18:02:45 EST 2004 | Sam El.
I was wondering if anyone has had any experience with either the Esec Micron 2 or the RD Automation CDB-50? We currently have a Micron 2 (1997 build). We are using it for small batches of flip chip. We use the waffle pack feeder not the wafer loader.
Electronics Forum | Mon Sep 11 00:31:13 EDT 2000 | rcsantos
Is there somebody who knows if there is a machine already available in market that can transfer die from wafer to waffle tray. This machine should a stand alone type or can be integrated to some P&P machine. What I'm trying to say is just like the on
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, Nr. 3
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, Nr. 1
Industry News | 2002-03-19 08:04:17.0
ESEC received a 2001 Preferred Quality Supplier (PQS) award from Intel Corp. for outstanding performance in providing products and services deemed essential to Intel's success. The company was awarded for its efforts in supplying Intel with flip chip attach equipment and die bonders.
Industry News | 2017-03-14 22:49:33.0
We would like to check if you have 2 units of 2nd hand ESEC 2009 SSI or 2007 FS DA machines, below is the details; Please advise the delivery terms & lead time.
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Parts & Supplies | Screen Printers
SMT Automatic ESE Printer Solder Paste Red Rubber Squeegee Blade
Events Calendar | Wed Apr 10 00:00:00 EDT 2019 - Fri Apr 12 00:00:00 EDT 2019 | Tokyo, Japan
ESEC Spring - Embedded Systems Expo
