Industry Directory | Manufacturer
Solder reflow and curing ovens for electronics assembly.
Industry Directory | Manufacturer
IVAS Tech is a manufacturer of high mix-low volume SMT equipment. Our latest product is HBSM for fully automated simultaneously assembly and soldering of Luxeon lighting Emitters.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Tue Nov 12 19:55:14 EST 2002 | davef
Recognize that the cost of production changes substantially with factors such as: * Product maturity. * Production volume. * Product complexity. * Quality versus cost functions. So, in your benchmarking effort, consider baselining your data accordin
Electronics Forum | Wed Sep 23 12:16:17 EDT 2009 | davef
The US EPA has a Toxics Release Inventory (TRI) program. They may have some information on paste wastage estimation for leaded pastes.
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE500 3D SPI Vintage: 2013 3D Height, Volume, and Area Measurements Max PCB Size: 20" x 20" Min PCB Size: 2" x 2" Complete & Operational
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Aug 10 00:00:00 EDT 2020 - Mon Aug 10 00:00:00 EDT 2020 | ,
Monitoring & Bench marking Your Processes and Assembly Yields
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
Career Center | Charleston, South Carolina USA | Accounting/Finance,Engineering,Management,Production,Research and Development,Sales/Marketing,Technical Support
UEC serves the aerospace, military, industrial, and commercial markets by providing comprehensive product design, system integration, and vertically integrated manufacturing solutions including: hardware, software, and mechanical engineering; rapid p
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
SMT Express, Volume 4, Issue No. 11 - from SMTnet.com Volume 4, Issue No. 11 Wednesday, November 20, 2002 Book Review Six Sigma for Electronics Design and Manufacturing by Sammy Shina Reviewed by Dave Fish (davef
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
Heller Industries Inc. | https://hellerindustries.com/1913mk7-2/
High Volume Reflow Oven -1913 Home » 1913MK7 1913 MK7 Reflow Oven The 1913 MK7 is a high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/072419-lubrication-systems-standard-vs-low-volume-low-pressure
Lubrication Systems: Standard vs. Low Volume Low Pressure Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
