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FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

Electronics Forum: eutectic attach au si (3)

press fit on Ni/Au board finish

Electronics Forum | Mon Apr 29 05:25:13 EDT 2002 | ianchan

Hi, we do Sn plated I/O pinning insertion into Ni/Au thru' holes. no problems here so far, as we cater for the "interference" (fit-allowances) of the I/O pin into the thru' diameter, via improved PCB thru' hole designs. before this cater/considerati

Problems with TI DSP modules

Electronics Forum | Tue Oct 23 09:09:27 EDT 2001 | Cemal Basaran

What is the reflow temperature you use to attach this package to your PCB.? I did extensive study on this package and compared it with other packages. I used our own Moire Interferometry, SEM, EDX studies. In my opinion the problem is TI does not man

Industry News: eutectic attach au si (21)

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

Videos: eutectic attach au si (1)

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

Videos

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html

Finetech

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Dispense System User Guide

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-User-Guide-22100079K.pdf

mobiles. SÉCURITÉ DE L’OPÉRATEUR Si vous utilisez un convoyeur, installer des barrières ou des signaux conformément aux règlements en vigueur pour empêcher l’accès sur les côtés de la machine où (1) les rails du convoyeur font saillie et (2) les découpes de

GPD Global


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