New Equipment | Solder Materials
8 hours in controlled environment) Prints consistently at a wide range of speeds Wide reflow process window for profiling Excellent wetting on a variety of surface finishes Maintains tack over time Suitable for SnPb eutectic alloys as well
New Equipment | Solder Materials
Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solde
Electronics Forum | Thu Jul 10 15:38:36 EDT 2008 | ck_the_flip
Amen to that Patrick. I am from a traditional Engineering background myself - they never taught wave solder in school. My curriculum was mostly theory and labs. When I got out, I read all the soldering books available at the time and also watched s
Electronics Forum | Mon Jun 05 14:10:54 EDT 2000 | C.K.
Dave: Thanks for you Earl-Moonesqe explanations. To answer your 3 questions below: * If there�s no flux in the via, why does the sodder flow? I thought it was the flux that removed corrosion to increase wetting that allowed
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2011-08-18 12:44:10.0
Nihon Superior introduces SN100C (551CT), the newest addition to its SN100C lead-free solder series.
Technical Library | 2014-10-02 20:10:07.0
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As the results, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently.In this paper, we'll present the performance and process capability of various low/no silver alloy solder pastes. Data from printability, wetting test, slump test, solder ball test, voiding, etc… will be discussed and compared with the control SAC305 solder paste. Benefits and concerns of using low/no silver alloy solder paste materials will also be addressed.
Technical Library | 2016-09-01 16:21:11.0
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. Our previous study showed that many alternative low silver solder paste materials had good printing and wetting performance as compared to SAC305 solder pastes. However, there is lack of information on the reliability of alternative alloy solder joints assembled using alternative low silver alloy solder pastes.In this paper, we will present the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling test (3000 cycles, 0°C to 100°C). Six different lead-free pastes were investigated. SAC305 solder joints were used as the control. Low and no silver solder pastes and a low temperature SnBiAg solder pastes were also included.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
parts off during double-sided reflow. Additionally, after eutectic solder is first melted, the alloying that occurs at the sol- der joint during reflow effectively increases the remelting point
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Activator cleans metal surfaces of oxides and contaminants, promoting wetting of Solder Alloy. Activator is consumed by heat over time
