Industry Directory | Manufacturer
DriSteem provides reliable and efficient humidity control, evaporative cooling, and water treatment solutions for commercial and industrial applications.
Utilise Gold contains an international business directory of suppliers of precious metal materials used in the electronics industry, including contacts, plating salts, pastes, solders, bonding wires and evaporation materials.
The DriSteem Adiatec ultrasonic humidifier provides evaporative cooling and humidification in room or in AHU/duct for application flexibility. Ultrasonic units humidify using high frequency oscillation of piezoelectric transducers, causing mist to de
Hydrotrue water softener systems The easiest and most cost-effective way to maintain humidification capacity and to reduce maintenance requirements is to install a Hydrotrue water softener system. Operating with softened water reduces or eliminates
Used SMT Equipment | Assembly Accessories
Description Lot# - 13360-97 Condition - Used/See Description Package Lot including all Lots except for Feeders, Changeover Tables and Docking Stations.This Lots contains below assets:ASM / Siemens Siplace 'SX-2' Placement Machine (2020)ASM
Used SMT Equipment | Other Equipment
EMC Evaporator IBE SMT Inventory ID : 151201-001 EMC Serial Number : 7809908 Vintage : Details • Model: 85ESS • 240 VAC 3-Phase 40 FLA 60Hz Click Here for more details or to request a quote online... IBE SMT Equipment 281-259-9660 Off
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2019-09-25 04:36:01.0
What is the main function of hot air dry oven? Drying ovens are devices used to remove moisture and other solvents from the items placed inside them through a forced convection process, collecting it elsewhere so that the object becomes dehydrated. A drying oven causes objects to dry out through evaporation. Drying ovens use convection heating,also called air forced, in which the object is heated through air currents. Water from the object escapes into the air, raising the humidity level and causing the semi-solid membranes inside the oven to absorb the water. The end result is that the oven removes water from the object being dried, leaving it dehydrated. Drying ovens contain a system for forcing convection currents to develop, usually either a fan or turbine, which aids in the heating and drying process by ensuring that the hot air circulates,many ovens are equipped with an adjustable ventilation system that allows the user to ensure that the system has an adequate air supply. For details,pls visit our website: https://climatechambers.com/articles&latestnews/what-is-the-main-function-of-hot-air-dry-oven.html
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
Events Calendar | Wed Jul 19 18:30:00 UTC 2023 - Wed Jul 19 18:30:00 UTC 2023 | Suwanee, Georgia USA
Atlanta Chapter Technical Meeting: The Science of Humidity Control in Manufacturing
| http://etasmt.com/cc?ID=te_news_bulletin,11162&url=_print
. The Principle of reflow soldering oven is divided into several descriptions: A. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-thick-pcbs-with-3-oz-copper
. Make sure the flux covers all the areas to be soldered and prepares those areas. Is it the correct flux? Does it evaporate too quickly, and is it easily applied
