Industry Directory: every layer interconnect (41)

Imagineering, Inc.

Imagineering, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Since 1986, our focus on delivering quality PCB's and Assemblies hasn't changed. Our top priority has always been to understand what the customer values, evaluate their needs and deliver the best-in-class service and products.

Electronic Interconnect

Industry Directory | Manufacturer

Electronic Interconnect (EI) is a professional PCB manufacturer in the USA since 1985, serving design engineers and contract assemblers. We can serve all proto to production PCB needs.

New SMT Equipment: every layer interconnect (240)

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

face mask manufacturing machine

face mask manufacturing machine

New Equipment | Industrial Automation

face mask manufacturing machine also known as one to three mask production line, composed of a mask body machine and three ear band composed of welding machine. Every minute can output 120-150 piece of complete plane mask, mask specificatio

ASCEN Technology

Electronics Forum: every layer interconnect (92)

GCpowerplace Inspection for Momentum Printer Bottom layer Issue

Electronics Forum | Tue Jan 15 10:08:19 EST 2019 | griinder

I'm looking for any experienced Graphicode software users for advice. We use Gerber EZ Teach(GC Powerplace) to offline program 2D inspection on our Momentum printers. I have an issue with mirrored apertures when creating my Bottom Side inspection pro

Inner Layer Separation from Barrel Wall - Too Much Heat?

Electronics Forum | Thu Nov 17 20:23:55 EST 2005 | davef

We're with your customer. We believe inner layer separation is not linked to a heating excursion. What you are seeing is separation between the hole wall and the copper plating in the barrel of the hole on an unstressed PTH. Although, it's possibl

Used SMT Equipment: every layer interconnect (11)

Agilent N4416A

Agilent N4416A

Used SMT Equipment | In-Circuit Testers

Agilent N4416A Balanced Measurement S-parameter Test Set, 300 kHz to 6 GHz The Agilent N4416A S-parameter test set is a key component of an Agilent physical layer and balanced-measurement system. When combined with an Agilent PNA Series E8356A,

Test Equipment Connection

Agilent N4416A

Agilent N4416A

Used SMT Equipment | In-Circuit Testers

Agilent N4416A Balanced Measurement S-parameter Test Set, 300 kHz to 6 GHz The Agilent N4416A S-parameter test set is a key component of an Agilent physical layer and balanced-measurement system. When combined with an Agilent PNA Series E8356A,

Test Equipment Connection

Industry News: every layer interconnect (256)

Park Electrochemical Corp. Declares Cash Dividend

Industry News | 2003-03-24 09:38:49.0

Declared a regular quarterly dividend of $0.06 per share payable May 6, 2003 to stockholders of record at the close of business on April 8, 2003.

SMTnet

Parts & Supplies: every layer interconnect (1)

Other SMT-2010

Other SMT-2010

Parts & Supplies | Soldering - Reflow

Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no

SMTmax

Technical Library: every layer interconnect (17)

Platings for Interconnections

Technical Library | 2019-06-04 10:19:46.0

Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.

ACI Technologies, Inc.

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

ASYMTEK Products | Nordson Electronics Solutions

Videos: every layer interconnect (25)

PCB Footprint Expert

PCB Footprint Expert

Videos

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

medical face mask making production machine

medical face mask making production machine

Videos

Link:https://www.ascen.ltd/Products/mask_making_machine/ Automatic medical face mask making production machine to produce the finished face mask ,and to weld face mask by ultrasonic .From material feeding for produce face mask blank to welding the ea

ASCEN Technology

Training Courses: every layer interconnect (1)

IPC J-STD-001 Space Addendum (CIT) Certification Training Course

Training Courses | ON DEMAND | | IPC J-STD-001 Space Trainer (CIT)

The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.

BEST IPC Training

Events Calendar: every layer interconnect (3)

Post – Moore's Law Electronics: From Now until Quantum Computing

Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,

Post – Moore's Law Electronics: From Now until Quantum Computing

Surface Mount Technology Association (SMTA)

SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design

Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,

SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design

Surface Mount Technology Association (SMTA)

Career Center - Resumes: every layer interconnect (1)

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

Express Newsletter: every layer interconnect (945)

Partner Websites: every layer interconnect (553)

Auction - Multi-Layer Technologies | The Branford Group

| http://www.thebranfordgroup.com/dnn3/Auction/MULA0623.aspx

Auction - Multi-Layer Technologies | The Branford Group Sign Up For Our Auction Email Alerts!         Home Auctions Upcoming Auctions Recent Auctions Asset Recovery Programs Industry Expertise Logistics

2 Layer Four wheel FUJI NXT Series SMT Feeder Carts

| https://www.feedersupplier.com/sale-13119315-2-layer-four-wheel-fuji-nxt-series-smt-feeder-carts.html

2 Layer Four wheel FUJI NXT Series SMT Feeder Carts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters


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