Industry Directory: excess chip (6)

ExcessChip Technology Limited

Industry Directory | Other

ExcessChip Technology Limited specializes in buying excess inventory of semiconductors and electronic components.

CoreChips

Industry Directory | Manufacturer / Manufacturer's Representative

CORECHIPS is an industry-leading independent electronic components distributor with cost-saving and reliable supply chain ,serving global customers with one-stop sourcing solution

New SMT Equipment: excess chip (5)

MARCH StratoSPHERE Plasma Treatment System

MARCH StratoSPHERE Plasma Treatment System

New Equipment | Surface Finish

Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications.  The StratoSPHERE plasma system is ideal for wafer pro

MARCH Products | Nordson Electronics Solutions

PACE IR 3000 Infrared BGA/SMT Rework System

PACE IR 3000 Infrared BGA/SMT Rework System

New Equipment | Rework & Repair Equipment

Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in

PACE Worldwide

Electronics Forum: excess chip (107)

chip placed upside down

Electronics Forum | Tue Jun 10 23:06:28 EDT 2014 | demzvill

In our assumption also, nozzle is magnetized because the chip termination is made up of alloy so possibilty that when there is excessive contact between two metals there magnetic field produce, so during z up chip is magnetize on the nozzle causing i

chip placed upside down

Electronics Forum | Wed Jun 11 11:33:26 EDT 2014 | fredcalkins

I do not have machine experience, but I think vacuum too early would be a more likely cause of chips leaping to a nozzle. Juki nozzles are made of hardened stainless and could be slightly magnetic, but the end is relatively small and would not have t

Used SMT Equipment: excess chip (8)

Samsung SM411

Samsung SM411

Used SMT Equipment | Pick and Place/Feeders

Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base

Qinyi Electronics Co.,Ltd

Samsung SM411 Chip Shooter

Samsung SM411 Chip Shooter

Used SMT Equipment | Pick and Place/Feeders

 Samsung SM411, Samsung SM411 Mounter, Second-hand Samsung SM411 Chip Shooter Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH an

KingFei SMT Tech

Industry News: excess chip (30)

Stencil aperture considerations for QFN chips

Industry News | 2018-10-18 08:40:47.0

Stencil aperture considerations for QFN chips

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Parts & Supplies: excess chip (11)

JOT Optical BGA Rework Station FG-

JOT Optical BGA Rework Station FG-

Parts & Supplies | Repair/Rework

Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking

Goodluck Electronic Equipment Co.,Ltd

Juki Original JUKI FEEDER UPPER COVER 3232 E620370600C

Juki Original JUKI FEEDER UPPER COVER 3232 E620370600C

Parts & Supplies | Pick and Place/Feeders

Hot sell JUKI FEEDER UPPER COVER 3232 E620370600C Original new Supply all juki spare parts at low price JUKI E95597210A0 BU PIN SENSOR CABLE ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI E95597290A0 VGA DISTRIBUTION CABLE ASM. www.fujintai.com JUKI E9

FUJINTAI Technology Co.,Ltd

Technical Library: excess chip (4)

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Technical Library | 2010-01-06 22:27:03.0

Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.

Henkel Electronic Materials

Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

Technical Library | 2007-08-09 12:23:10.0

Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.

Universal Instruments Corporation

Videos: excess chip (14)

DIP Double-side Camera Online AOI Machine ETA-V5300

DIP Double-side Camera Online AOI Machine ETA-V5300

Videos

DIP Double-side Camera Online AOI Machine ETA-V5300​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac

Dongguan Intercontinental Technology Co., Ltd.

Off-line SMT AOI Machine

Off-line SMT AOI Machine

Videos

SMT Off-line AOI Machine ETA-V8​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI inspection

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: excess chip (1)

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Career Center - Resumes: excess chip (1)

SMT Manufacturing

Career Center | , | Engineering,Maintenance,Production

Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma

Express Newsletter: excess chip (402)

Partner Websites: excess chip (163)

IPC-A-610 Acceptable Requirements for Nicks and Chip-Outs - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-acceptable-requirements-for-nicks-and-chip-outs

. The defect condition on the page discusses the requirements for all 3 classes and it mentions “…any nicks or chip-out in the termination area, or exposing and electrode, any cracks or stress fractures, or any damage in excess of Table 9-1

CMOS Setup Procedure for 2025-0064

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/CMOS-Setup-Procedure-for-2025-0064-22100114-6-v18.pdf

. Highlight OnChip Serial ATA using the arrow keys, and then press ENTER. 4. In the On-Chip Serial ATA screen that displays, highlight Auto, and then press ENTER. 5

GPD Global


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