ExcessChip Technology Limited specializes in buying excess inventory of semiconductors and electronic components.
Industry Directory | Manufacturer / Manufacturer's Representative
CORECHIPS is an industry-leading independent electronic components distributor with cost-saving and reliable supply chain ,serving global customers with one-stop sourcing solution
New Equipment | Surface Finish
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications. The StratoSPHERE plasma system is ideal for wafer pro
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
Electronics Forum | Tue Jun 10 23:06:28 EDT 2014 | demzvill
In our assumption also, nozzle is magnetized because the chip termination is made up of alloy so possibilty that when there is excessive contact between two metals there magnetic field produce, so during z up chip is magnetize on the nozzle causing i
Electronics Forum | Wed Jun 11 11:33:26 EDT 2014 | fredcalkins
I do not have machine experience, but I think vacuum too early would be a more likely cause of chips leaping to a nozzle. Juki nozzles are made of hardened stainless and could be slightly magnetic, but the end is relatively small and would not have t
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411, Samsung SM411 Mounter, Second-hand Samsung SM411 Chip Shooter Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH an
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Repair/Rework
Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking
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Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI FEEDER UPPER COVER 3232 E620370600C Original new Supply all juki spare parts at low price JUKI E95597210A0 BU PIN SENSOR CABLE ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI E95597290A0 VGA DISTRIBUTION CABLE ASM. www.fujintai.com JUKI E9
Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
Technical Library | 2007-08-09 12:23:10.0
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
SMT Off-line AOI Machine ETA-V8 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI inspection
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
array (BGA) and chip scale package (CSP) manufact
| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-acceptable-requirements-for-nicks-and-chip-outs
. The defect condition on the page discusses the requirements for all 3 classes and it mentions “…any nicks or chip-out in the termination area, or exposing and electrode, any cracks or stress fractures, or any damage in excess of Table 9-1
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/CMOS-Setup-Procedure-for-2025-0064-22100114-6-v18.pdf
. Highlight OnChip Serial ATA using the arrow keys, and then press ENTER. 4. In the On-Chip Serial ATA screen that displays, highlight Auto, and then press ENTER. 5
