Industry Directory | Manufacturer
MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.
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New Equipment | Board Handling - Conveyors
Automatic PCB Magazine Loader LD-M-BN Feature ▶Firm structure ▶User friendly'soft touch' LED membrance control panel/ touch screen ▶Dual clamps to secure magazine rack. ▶Empty PCB detection. ▶Automatical fault diagnosing. ▶Wear-resistant cable and h
New Equipment | Board Handling - Conveyors
Automatic SMT PCB Magazine Unloader UL-M-BN Feature ▶Strong,firm and stable design. ▶User friendly'soft touch' LED membrance control panel or touch screen can be selected. ▶Top&bottom pneumatic clamps to secure magazine rack . ▶No PCB breakage guara
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Used SMT Equipment | AOI / Automated Optical Inspection
2011 MIRTEC MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13110930-0839 DOM: 30 SEP 2011 2D Inspection Power: 85-264V / 4.4A / 50-60 Hz INSPECTION AREA: 450 x 400 mm INSPECTION ITEMS:&n
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Automatic PCB Magazine Loader LD-M-BN Feature ▶Firm structure ▶User friendly'soft touch' LED membrance control panel/ touch screen ▶Dual clamps to secure magazine rack. ▶Empty PCB detection. ▶Automatical fault diagnosing. ▶Wear-resistant cable and h
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
Solder Ball Defects-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Solder Ball Defects Solder Ball Defects Defect
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
. The NSMD BGA pad stack is necessary for the Ball to fully collapse around the pad edge securing it to the PCB - The SMD (Solder Mask Defined) BGA pad stack prevents the Ball Collapse
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