Electronics Forum | Fri Apr 04 14:49:51 EDT 2008 | tombstone
Flux seperation is a common problem observed due to expiration of paste. The symptom is a yellow layer of flux when you open the jar. Excess flux separation will cause priting problems such as smearing and slumping.
Electronics Forum | Thu Apr 03 17:25:49 EDT 2008 | alexs
Hi All, I have some question about expired solder paste. What would be some of the effects regarding assembly quality. Is there any changes in flux composition toward the end of shelf life? Thanks in advance for any replies.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. The oxide layer on pads or the pin’s surface has not been removed effectively. The solder paste has expired, so its flux is inactive
Heller Industries Inc. | https://hellerindustries.com/voids/
Circuit Board Voids Home » Circuit Board Voids Re-printed in partnership with ITM Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder
