Nextreme designs and manufactures manufactures micro-scale electronics cooling and energy harvesting solutions for telecommunications, semiconductor, consumer, medical, aerospace and government markets.
Industry Directory | Manufacturer
1 to 30-layer FR-4 PCBs with HDI, Aluminum based PCBs, Copper based PCBs & Iron based PCBs; - Prototype and mass production of High-Mix, Medium or Low-Volume orders. - Quality Guaranteed.
New Equipment | Fabrication Services
Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger Solder mask color: green Size: 125.09 x 95.25/1up SMT SMD, 230 DIP and 4 pieces component
New Equipment | Assembly Services
Edge Plating does not have a set definition per IPC. However, the industry generally accepts this as being copper plating that continues from the top and bottom surfaces and along one or more perimeter edges. Edge Plating can be used for a variety of
Electronics Forum | Fri Oct 20 14:13:32 EDT 2000 | DENNIS XIONG
Dear all, We have a PCB design mistake that causes exposed copper layers on the edges of breakaway locations. Although we fixed the design, but we already made a lot of boards plus many made before we found the problem. I wonder if any one have some
Electronics Forum | Sat Oct 21 03:55:14 EDT 2000 | DL
Dennis, I've seen this before, and in our case we didn't need to seal the edges because there was no concern of shorting or anything in the end product, this is a choice you will have to make, Does your end product have any protrusions or mounting h
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2014-10-01 15:59:00.0
PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.
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Parts & Supplies | Pick and Place/Feeders
Place of Origin: China( Mainland ) Brand Name: FUJI Model Number: MCA0140 Type: Feeder Small copper MOQ: 1PCS Stocks: Yes Port: Shenzhen A. 11 years experience, quality guarantee B. Participate in NEPCON
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Parts & Supplies | Pick and Place/Feeders
Place of Origin: China( Mainland ) Brand Name: FUJI Model Number: MCA0152 Type: Feeder big copper MOQ: 1PCS Stocks: Yes Port: Shenzhen A. 11 years experience, quality guarantee B. Participate in NEPCON So
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
Technical Library | 2017-06-13 17:14:59.0
For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Laser direct imaging exposes certain parts of the board to light in the shape of the PCB pattern. Any unexposed parts of the board will develop off, leaving the remaining film as an etch barrier The remaining film serves as an etch barrier that will be removed from the exposed copper to form the copper circuitry
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. Phenolic resin is resistant to weak acids and weak bases. It will decompose when exposed to strong acids and will corrode when exposed to strong bases
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