Development of Ultra-Multilayer Printed Circuit Board Development of Ultra-Multilayer Printed Circuit Board This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets
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. (You may also place all large tables and graphics is an Appendix at end of the paper after your REFERENCES) The third development stage was to build the actual notebook or desktop production motherboard in a lead-free configuration and perform the full battery of board level and system level testing
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maintain the following environmental conditions in the area: 1. Room temperature: (22 ± 3) °C 2. Relative humidity at room temperature (55 ± 10) %. c. The work stations shall not be exposed to draughts. 13 ECSS‐Q‐ST‐70‐18C 15 November 2008 d
