Industry Directory | Manufacturer
Extreme Laser Works provides the industry with custom cutting of plastic, curcuit boards and wooden items. We can laser engrave text into many different materials. We use a CO2 machine size 12X24
Industry Directory | Manufacturer's Representative
Extreme Components engaged in this field (Electronics) for years. We specialize in kinds of electronic components such as Active, Passive, Electro-Mechanical and so on. We are focuses on satisfying customer needs, meeting international standards for
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
ProntoSELECTIVE-SOLDERING is used by electronic manufacturers to quickly program their Selective Soldering machines. ProntoSELECTIVE-SOLDERING helps program most popular Selective Soldering machines such as ACE Production Technologies, RPS Autom
Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar
Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like
Electronics Forum | Thu Feb 02 09:07:28 EST 2023 | charles_nguyen
Two types of land patterns used for surface mount pads are non-solder mask defined or NSMD pads and solder mask defined or SMD pads.Each type has its own advantages and disadvantages. There is a statement that SMD pad type may introduce stress concen
Used SMT Equipment | AOI / Automated Optical Inspection
Eceed PARMI 3D AOI High speed 3D AOI platform Equipped with innovative colour textured 3D sensor Shorten teaching time by virtue of smart algorithm Easy to use simple & intuitive GUI Extremely low false call and escape
Used SMT Equipment | SPI / Solder Paste Inspection
MS-11e 3D SPI Equipment High Speed Precision In-Line SPI Equipment System Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System. 10 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design Advanced Dual Projection SHADOW FREE MOIRé Design 2 Micron Heig
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2003-02-06 09:14:22.0
This Makes the 6th Emma Tester in South Africa
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Parts & Supplies | Pick and Place/Feeders
Buy High-speed Modular Mounter FX-1R The High-speed Modular Mounter FX-1R is a traditional modular chip shooter driven at extreme speeds. Refinements in the drive system deliver real world improvements in actual throughput. ■ 33,00
Parts & Supplies | Assembly Accessories
NO. GREASE MODEL PACKAGING 1 Three Bond 2706 Oil & Grease Removing Agent 420ML/PC 10PC/Carton 2 BIRAL T&D spary lubricant 500ML/PC 12PC/Carton 3 BIRAL VG-HT spary lubricant 500ML/PC 12PC/Carton 4 BIRAL BIO-30 high temperature chain oil 1000G
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Events Calendar | Mon Jul 08 00:00:00 EDT 2024 - Mon Jul 08 00:00:00 EDT 2024 | ,
Heartland Chapter Technical Webinar: Virtual STAR Forum
Career Center | Bedford, Texas USA | Technical Support
Provide technical support for external and internal customers for SMT/PCBA equipment issues. Manage and implement mandatory service info bulletins, intitiate and monitor new product launch procedures, develop new vehicles for faster and better distr
Career Center | Oakville, Ontario Canada | Engineering,Management,Production,Quality Control,Research and Development
Individuals who excel in this position enjoy working on the hardware-software boundary, are driven by complex problem solving in a fast paced environment. Candidate should be familiar with most of the electronic technologies and be able to work wit
Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support
11 years experience in SMT process.
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267
SMTnet Express, August 14, 2014, Subscribers: 23098, Members: Companies: 13988, Users: 36651 Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization. Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto; i3
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/hu-HU/divisions/efd/products/syringe-barrels-and-cartridges/unity-hitemp-syringe-barrel
beszerzési és üzemeltetési költség. A Unity fecskendők típusai Átlátszatlan Extreme HiTemp fecskendők Ezek a fecskendők akár 7 bar (100 psi) nyomáson is ellenállnak a 180° C-os (356° F-os) hőmérsékletnek. Poliamidokkal és más típusú forró, olvasztott anyagokkal
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/4-key-attributes-that-pcbs-need-for-aerospace-deployment/
between components and the board surface to help relieve some of the stress the PCB may experience. 2. High-Temperature Resistance In an aerospace platform, extreme temperature changes are pretty common in everyday operations. It doesn’t matter if
