Industry Directory | Manufacturer
Extreme Laser Works provides the industry with custom cutting of plastic, curcuit boards and wooden items. We can laser engrave text into many different materials. We use a CO2 machine size 12X24
Industry Directory | Manufacturer's Representative
Extreme Components engaged in this field (Electronics) for years. We specialize in kinds of electronic components such as Active, Passive, Electro-Mechanical and so on. We are focuses on satisfying customer needs, meeting international standards for
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
► Exclusive 10MP / 18MP Camera Technology ► Precision Telecentric Compound Lens Design ► Eight Phase Color Lighting System ► 10MP / 18MP SIDE-VIEWER® Camera System ► Extremely Simple Programming and Operation ► Integrated INTELLI-BEAM® L
Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar
Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like
Electronics Forum | Thu Feb 02 09:07:28 EST 2023 | charles_nguyen
Two types of land patterns used for surface mount pads are non-solder mask defined or NSMD pads and solder mask defined or SMD pads.Each type has its own advantages and disadvantages. There is a statement that SMD pad type may introduce stress concen
Used SMT Equipment | AOI / Automated Optical Inspection
Eceed PARMI 3D AOI High speed 3D AOI platform Equipped with innovative colour textured 3D sensor Shorten teaching time by virtue of smart algorithm Easy to use simple & intuitive GUI Extremely low false call and escape
Used SMT Equipment | SPI / Solder Paste Inspection
MS-11e 3D SPI Equipment High Speed Precision In-Line SPI Equipment System Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System. 10 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design Advanced Dual Projection SHADOW FREE MOIRé Design 2 Micron Heig
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2021-04-15 11:50:56.0
Whizz Systems, Inc. today announced the appointment of Dan Williams as Director, Sales & Marketing.
Parts & Supplies | Pick and Place/Feeders
We have laser unit for JUKI kEKE2010/2050/2060/2040/2020/FX-1 for sale. New & used avaliable.In order to extremely cut down your expenditure,we offer highly professional repair service for the one not in good condition. Our 15 years' experience in
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Parts & Supplies | Pick and Place/Feeders
Buy High-speed Modular Mounter FX-1R The High-speed Modular Mounter FX-1R is a traditional modular chip shooter driven at extreme speeds. Refinements in the drive system deliver real world improvements in actual throughput. ■ 33,00
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-05-31 14:19:24.0
ACI Technologies (ACI) characterized the reliability of surface mount RF components. The RF frequency band of interest was the X band (10.7 to 11.7GHz). A two pronged test for reliability of circuit card assemblies (CCA) was designed for both extreme thermal cycling and vibration. The rapid thermal cycling and extreme vibration testing simulates the total stress encountered by the assembly over the life of the product but accomplishes it in a relatively short period of time. In order to perform the reliability testing, a test vehicle consisting of a printed circuit board with test structures and components, was designed, fabricated, and assembled at ACI.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France
2017 RaMP Workshop and Tabletop Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | Bedford, Texas USA | Technical Support
Provide technical support for external and internal customers for SMT/PCBA equipment issues. Manage and implement mandatory service info bulletins, intitiate and monitor new product launch procedures, develop new vehicles for faster and better distr
Career Center | Oakville, Ontario Canada | Engineering,Management,Production,Quality Control,Research and Development
Individuals who excel in this position enjoy working on the hardware-software boundary, are driven by complex problem solving in a fast paced environment. Candidate should be familiar with most of the electronic technologies and be able to work wit
Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support
11 years experience in SMT process.
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267
SMTnet Express, August 14, 2014, Subscribers: 23098, Members: Companies: 13988, Users: 36651 Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization. Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto; i3
| https://fluxconnectivity.com/resources/faq/
we’re a custom manufacturer, we can design and manufacture products to suit your requirements. If you require a product to be resistant to extreme heat, extreme cold, or high movement, we manufacture accordingly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/hu-HU/divisions/efd/products/syringe-barrels-and-cartridges/unity-hitemp-syringe-barrel
beszerzési és üzemeltetési költség. A Unity fecskendők típusai Átlátszatlan Extreme HiTemp fecskendők Ezek a fecskendők akár 7 bar (100 psi) nyomáson is ellenállnak a 180° C-os (356° F-os) hőmérsékletnek. Poliamidokkal és más típusú forró, olvasztott anyagokkal
