Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Tue Oct 10 13:32:26 EDT 2006 | rsteele
Does anyone know of any tests or testing done on the peel strength of components to pads. I have alot of info on FAB level peel strength testing, but nothing on components themselves. Is there any process(es) to test and insure new pastes and reflo
Industry News | 2022-08-14 14:24:27.0
Naprotek, LLC. has completed the acquisition of MicroFab, Inc., a privately held company in Manchester, New Hampshire. This acquisition is a strategic element of Naprotek's continued expansion in RF products, services, and solutions. Naprotek now offers customers an array of custom build-to-print thin film products, supported by enhanced capabilities and a wider spectrum of thin film technologies. The business and entire MicroFab team will be integrated into the East Coast operations at SemiGen, a Naprotek Company.
Industry News | 2010-06-04 17:17:16.0
Christopher Associates Inc. announces that it now ships qualification samples of the Jolywood FFC-JW30 advanced photovoltaic backsheet material. Using patented technology, Jolywood has achieved a breakthrough in environmental resistance and electrical performance.
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-assembly-how-does-it-work/
. Some things to include are: Mechanical strength Electrical conduction Purity Soldering quality Lamination – Peel and strength Hole wall quality Component polarity, placement, alignment, positioning, etc
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
@indium.com 1228 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2377-5726/22/$31.00 ©2022 IEEE DOI 10.1109/ECTC51906.2022.00197 Fig 2: Mean Heat Flux by Wafer Fab Node
