Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Mon Apr 26 17:45:26 EDT 1999 | Earl Moon
| | | Earl said, in essence: | | | | | | | Justin is absolutely right ... | | | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those
Industry News | 2002-03-29 08:28:28.0
Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England
Industry News | 2013-01-15 12:52:06.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announced today that the Atlanta SMTA Expo would return to the Gwinnett Civic Center in Duluth,
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
(in the fab notes, Note 1). But I never have used an IPC reference on my assembly drawings except IPC J-STD-001D - Requirements for Soldered Electrical and Electronic Assemblies
| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/
? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc
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