Industry Directory | Manufacturer
Custom High Density Flex Circuit Process Design and Manufacturing In Days, not Weeks.
Industry Directory | Consultant / Service Provider / Manufacturer
CableEye® continuity and HiPot pass/fail & diagnostic Cable & Harness Test Systems w simple scripting, labeling, documentation, cataloging & relay control. Dynamically display continuity, Ω, diodes, IR, dielectric breakdown & more
New Equipment | Assembly Services
If you are an EMS provider or OEM of electronic/electrical components or sub-assemblies incorporating plastics, metals, ceramics or any combination of these, BEST Inc can offer you knowledgeablePCB x-ray inspection services. BEST experiences in thes
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Electronics Forum | Tue Jun 08 22:30:05 EDT 2021 | vtdivtecs
So I am having a little trouble with my mydata MY19. its an older machine picked up used and its had its quirks. recently we tried to start adding electrical verification to our workflow, and had to disable it as we were getting intermittent bad pa
Electronics Forum | Tue Jun 13 16:45:30 EDT 2006 | adlsmt
If the only difference is the layer count, check the profile as stated above. If you dont have a profiler you can probably get the local Kic or Mole rep to do a demo on that board. I believe I was the one who stated in an old post that prying the lea
Used SMT Equipment | General Purpose Test & Measurement
The Tektronix TDS5104B oscilloscope is a graph-displaying device - it draws a graph of an electrical signal. In most applications, the graph shows how signals change over time: the vertical (Y) axis represents voltage and the horizontal (X) axis repr
Used SMT Equipment | General Purpose Test & Measurement
Tektronix TDS5104B Bandwidth: 1 Ghz Channels: 4 1 GHz, 5 GS/s, 4 Channel Digital Phosphor Oscilloscope The Tektronix TDS5104B oscilloscope is a graph-displaying device - it draws a graph of an electrical signal. In most applications, the graph s
Industry News | 2018-04-15 20:01:15.0
SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2012-03-26 15:58:58.0
Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.
Technical Library | 2013-04-04 15:28:39.0
This paper will outline and define what requirements must be adhered to for the OEM community to truly achieve the IPC class product from the Electrical Test standpoint. This will include the test point optimization matrix, Isolation (shorts) parameters and Continuity (opens) parameters. This paper will also address the IPC Class III/A additional requirements for Aerospace and Military Avionics. The disconnect exists between OEMs understanding the requirements of their specific IPC class design versus the signature that will be presented from their design. This results in many Class III builds failing at Electrical Test... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
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Career Center | Clarksburg, Maryland | Engineering
Immediate opportunities for SMT Solder Specialist. Also have these positions open. All immediate opportunities: Assembler: Must have strong electro mechanical manufacturing skills. Experience with assembly of electro mechanical products in a high
Career Center | San Jose, Nationwide | Engineering,Management
This world-renowned $13B organization is seeking a Product Reliability Engineering Manager (to report directly into the VP) for our San Jose, CA corporate technology office. We prefer candidates in the Silicon Valley area, but will consider candidat
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
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Imagineering, Inc. | https://www.pcbnet.com/blog/controlling-signal-integrity-in-high-speed-pcb-design/
. Signal integrity issues occur when: The shape of a signal changes from the intended state. Electrical noise degrades the signal to noise ratio Undesired noise influences other signals and circuits on a PCB
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/making-mounting-holes-in-footprint_topic1411.html
. These are part of the body of the connector, not electrical pins. I've had some puzzling problems trying, with Pad Stack Designer, to create these holes. 1
