Industry Directory | Consultant / Service Provider
SEM Lab, Inc. provides failure analysis, materials characterization, scanning electron microscopy (SEM) and FTIR services. We specialize in failure analysis of electronic components & assemblies. (see www.semlab.com/blog)
Industry Directory | Consultant / Service Provider
Troubleshooting and failure analysis for the electronic industry
New Equipment | Rework & Repair Services
ScanCAD provides comprehensive electronics reverse engineering services, transforming physical printed circuit boards (PCBs), ceramic substrates, and hybrids into complete manufacturing data packages. Utilizing advanced, high-resolution scanning syst
ZMD820 Standard Online AOI Inspection solution Feature ▶Flexible/multi-purpose AOI. ▶Vector analysis algorithm to achieve the best detection capability. ▶German brand 5 million pixel industrial camera. ▶The whole board is matched with multiple detec
Used SMT Equipment | X-Ray Inspection
Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Vintage: Year 2014 PCB Direction: Left to Right Condition: Refurbished, working Running Hours: Series Number:X215914 Missing Parts: No Warra
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Wed Apr 21 18:30:00 UTC 2021 - Wed Apr 21 18:30:00 UTC 2021 | ,
Ohio Chapter Meeting: Industry 4.0 / Non-Destructive Failure Analysis
Events Calendar | Mon Sep 21 18:30:00 UTC 2020 - Mon Sep 21 18:30:00 UTC 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Toronto, Ontario Canada | Engineering,Production,Quality Control
Work on ICT and functional test failures. Troubleshoot assemblies to the component level. Minimum one year of experience in Failure Analysis or In-Circuit Testing, or a recent graduate with a heavy course emphasis in this area. Understanding of
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
Career Center | Mariveles, Philippines | Engineering,Production,Quality Control
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
SMTnet Express, January 26, 2023, Subscribers: 24,669, Companies: 11,705, Users: 27,703 █ Electronics Manufacturing Technical Articles Non-Destructive Test Methods Failure analysis (FA), by its very nature, is needed only when things
SMTnet Express, August 15, 2024, Subscribers: 25,767, Companies: 12,181, Users: 29,088 █ Electronics Manufacturing Technical Articles Component Failure Analysis - Hermetic Packaging Recently ACI Technologies was asked to perform
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
: Failure Analysis of Electronic Devices M. Simard-Normandin, Ph.D., MuAnalysis Inc. Course Objectives: The supply chain of electronic devices is large and complex
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2375.html
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