Industry Directory | Consultant / Service Provider
SEM Lab, Inc. provides failure analysis, materials characterization, scanning electron microscopy (SEM) and FTIR services. We specialize in failure analysis of electronic components & assemblies. (see www.semlab.com/blog)
Industry Directory | Research Institute / Laboratory / School
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing ...
New Equipment | Assembly Services
If you are an EMS provider or OEM of electronic/electrical components or sub-assemblies incorporating plastics, metals, ceramics or any combination of these, BEST Inc can offer you knowledgeablePCB x-ray inspection services. BEST experiences in thes
New Equipment | Rework & Repair Services
ScanCAD provides comprehensive electronics reverse engineering services, transforming physical printed circuit boards (PCBs), ceramic substrates, and hybrids into complete manufacturing data packages. Utilizing advanced, high-resolution scanning syst
Used SMT Equipment | X-Ray Inspection
Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Vintage: Year 2014 PCB Direction: Left to Right Condition: Refurbished, working Running Hours: Series Number:X215914 Missing Parts: No Warra
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Inline 3D PCB Automated X-ray Inspection System - Advanced Quality Assurance Solution ❙ Introduce of SMT PCBA X-ray Machine Explore our Inline 3D PCB Automated X-ray Inspection System, a cutting-edge solution for advanced quality assurance in PCB
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Mon Sep 21 18:30:00 UTC 2020 - Mon Sep 21 18:30:00 UTC 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Events Calendar | Wed Apr 21 18:30:00 UTC 2021 - Wed Apr 21 18:30:00 UTC 2021 | ,
Ohio Chapter Meeting: Industry 4.0 / Non-Destructive Failure Analysis
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
Career Center | Mariveles, Philippines | Engineering,Production,Quality Control
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
SMTnet Express, January 25, 2024, Subscribers: 25,319, Companies: 12,002, Users: 28,668 █ Electronics Manufacturing Technical Articles Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step
SMTnet Express, February 29, 2024, Subscribers: 25,362, Companies: 12,025, Users: 28,728 █ Electronics Manufacturing Technical Articles Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
: Failure Analysis of Electronic Devices M. Simard-Normandin, Ph.D., MuAnalysis Inc. Course Objectives: The supply chain of electronic devices is large and complex
