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At C I Network Technologies, we are capable of supporting our customers in development of products. Quick turn PCB assembly shortens the product development cycle and requires efficiency and precision.
Electronics Forum | Tue Jan 21 16:28:02 EST 2003 | tony_sauve
Sorry I didn't close this one off last year... We had some failure analysis done on these PCB's ( 3D x-ray,microsectioning,SEM) and the results definitively proved that there was some contamination @ the base of the uvia's that had the voiding. It ap
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Industry News | 2013-07-24 16:39:34.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Industry News | 2013-07-24 22:01:53.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
Technical Library | 2023-01-10 20:08:36.0
Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ ICS Triplex Digital DC input modules provide input detection for 16 fields input switches There
SUPPORT & NEWS Sales and Technical Service Packing and Shipping Latest News Download Catalogue CONTACT US Symor Instrument Equipment Co.,Ltd Email:Sales@climatechambers.com Tel: +86-551-63853683,68663633,663853681 Fax:+86-551-68663630 A
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Events Calendar | Fri Apr 16 00:00:00 EDT 2021 - Fri Apr 16 00:00:00 EDT 2021 | ,
Auburn University Student Chapter Event: Get Hired in Electronics Industry
Career Center | nagercoil, India | Maintenance,Production
3.5 year's experience in smt. Am looking for a growth orinted organization .
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
SMTnet Express, September 23, 2021, Subscribers: 26,674, Companies: 11,444, Users: 26,860 Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize
SMTnet Express, September 16, 2021, Subscribers: 26,691, Companies: 11,438, Users: 26,841 Mathematical Model For Dynamic Force Analysis Of Printed Circuit Boards Mathematical model for dynamic force analysis of printed circuit
Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/in-house-certification.cfm
: Solderability Benchmarking, Failures & Production Testing Methods July 6, 2020 July 8 Webinar: Europe Chapter: Systematic Failure Analysis Webinar July 8, 2020 July 9 Webinar
| https://productronica.com/en/trade-fair/press/press-releases/detail/sensors-in-electronics-manufacturing.html
& FAQ Buy your ticket SEMICON Europa Nov. 12-15, 2024 productronica worldwide India Sept. 11-13, 2024 China Mar. 20-22, 2024 productronica 2025 / For journalists / Press releases / Detail Press release Sensors in electronics manufacturing October 11, 2023 Billion-dollar market for industrial sensors through
