Industry Directory | Research Institute / Laboratory / School
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing ...
Industry Directory | Consultant / Service Provider
An internationally accredited, full service testing and analysis company providing design studies, failure analyses, product/material qualifications, safety inspections, and consulting services
Determine why product fails in the field by reviewing process checkpoints
Electronics Forum | Tue Jul 19 21:24:04 EDT 2005 | davef
This is a bit dated, but it'll give you a starting point. test lab failure analysis IC; Accurel Materials Analysis Group (FIB, FESEM,TEM) 785 Lucerne Dr Sunnyvale, CA 94086; 408-737-3892 Fax 3916 Suzanne Francisco X146 suzannef@accurel.com test la
Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee
What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold
Used SMT Equipment | X-Ray Inspection
Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Vintage: Year 2014 PCB Direction: Left to Right Condition: Refurbished, working Running Hours: Series Number:X215914 Missing Parts: No Warra
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,
Ohio Chapter Meeting: Industry 4.0 / Non-Destructive Failure Analysis
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
Career Center | Manila, Philippines | Engineering
I am an experienced Electronics Engineer which is capable in electronics circuit design, trouble shooting and debugging. Have been involved in an R and D environment for 10 years which focus on the designing of power electronics circuit. Currently ho
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Front Page THE LABORATORY A PRIMARY EVALUATION AND QUALIFICATION FACTOR TO DETERMINE PCB SUPPLIER PROCESS CAPABILITIES Earl
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
Environments Jacob Kleiman, Integrity Testing Laboratory Inc. Failure Analysis of SAC305 Assemblies for Digital Hearing Aids Mircea Capanu, Ph.D., P.Eng
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2375.html
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