Industry Directory | Consultant / Service Provider
Materials testing lab.
Industry Directory | Consultant / Service Provider
An internationally accredited, full service testing and analysis company providing design studies, failure analyses, product/material qualifications, safety inspections, and consulting services
New Equipment | Rework & Repair Services
ScanCAD provides comprehensive electronics reverse engineering services, transforming physical printed circuit boards (PCBs), ceramic substrates, and hybrids into complete manufacturing data packages. Utilizing advanced, high-resolution scanning syst
ZMD820 Standard Online AOI Inspection solution Feature ▶Flexible/multi-purpose AOI. ▶Vector analysis algorithm to achieve the best detection capability. ▶German brand 5 million pixel industrial camera. ▶The whole board is matched with multiple detec
Used SMT Equipment | X-Ray Inspection
Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Vintage: Year 2014 PCB Direction: Left to Right Condition: Refurbished, working Running Hours: Series Number:X215914 Missing Parts: No Warra
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Glenbrook Technologies' JewelBox X-ray Inspection Technology
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Mon Sep 21 18:30:00 UTC 2020 - Mon Sep 21 18:30:00 UTC 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Events Calendar | Wed Apr 21 18:30:00 UTC 2021 - Wed Apr 21 18:30:00 UTC 2021 | ,
Ohio Chapter Meeting: Industry 4.0 / Non-Destructive Failure Analysis
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | , | 2017-11-02 10:24:18.0
Responsible for construction of prototype circuits/controls, troubleshooting electrical issues and conducting testing to verify electronic design. From schematics, assemble prototype circuits and/or controls to prove out design concepts. Working
Career Center | Shanghai, China | Engineering,Research and Development,Technical Support
Lead the operation and activity of UIC SMT Lab in China site. Operations include the following: 1. Prototyping of electronic and semiconductor packaging �� Flip chip prototyping, Pin-in-Paste prototyping, Pb-free process assembly 2. Failure analysis
Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Front Page THE LABORATORY A PRIMARY EVALUATION AND QUALIFICATION FACTOR TO DETERMINE PCB SUPPLIER PROCESS CAPABILITIES Earl
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
Environments Jacob Kleiman, Integrity Testing Laboratory Inc. Failure Analysis of SAC305 Assemblies for Digital Hearing Aids Mircea Capanu, Ph.D., P.Eng
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2375.html
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