Industry Directory: failure mode/mechanism distribution (1)

HILEVEL Technology, Inc.

Industry Directory | Manufacturer

HILEVEL Technology, Inc. is a world leader in American made low-cost IC test systems for Production, Engineering, and Failure Analysis since 1979.

New SMT Equipment: failure mode/mechanism distribution (1344)

Automatic SMT Stencil Cleaning Machine BMP-1000X

Automatic SMT Stencil Cleaning Machine BMP-1000X

New Equipment | Cleaning Equipment

Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protectio

Qinyi Electronics Co.,Ltd

Sherlock - Automated Design Analysis software

Sherlock - Automated Design Analysis software

New Equipment | Software

Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right

DfR Solutions

Electronics Forum: failure mode/mechanism distribution (15)

GSM Precise Location Failure Rejects

Electronics Forum | Thu Jun 16 03:23:40 EDT 2022 | leaderway0

AI/SMT spare parts and SMT equipment vendors from China-Leaderway Industrial Co., Ltd. The main distribution brands are Fuji, Samsung, Juki, Yamaha, Universal, Panasonic, Siemens, and Sony. Our websites: http://www.leadersmt.com Contact us !!! Email

X7R woes

Electronics Forum | Mon Dec 26 13:31:16 EST 2005 | mariss

Addendum: The boards are 2" by 2.4" (50mm by 60mm) and have 158 SMT components and 20 thru-hole parts. The nine X7R caps are distributed over the board; some are in the middle, others are near the V-grooved board edges. There is no discernable rel

Industry News: failure mode/mechanism distribution (154)

SMTA Announces Pan Pacific Symposium Call for Papers

Industry News | 2010-05-30 23:23:13.0

Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.

Surface Mount Technology Association (SMTA)

Pan Pacific 2011 Call for Abstracts

Industry News | 2010-08-17 13:31:00.0

The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!

Surface Mount Technology Association (SMTA)

Technical Library: failure mode/mechanism distribution (1)

Latent short circuit failure in high-rel PCBs caused by lack of cleanliness of PCB processes and base materials

Technical Library | 2021-03-10 23:57:29.0

Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...

European Space Agency

Videos: failure mode/mechanism distribution (2)

ASSCON VP2000 Vapor-Phase Soldering Machine

ASSCON VP2000 Vapor-Phase Soldering Machine

Videos

The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces

A-Tek Systems Group LLC

Brand new and original

Brand new and original

Videos

>>CONTACT  MAC  NOW Email: at@mooreplc.com Mobile: +8618020714662(WhatsApp) Skype: +8618020714662 >>>CONTACT  MAC  NOW ✦ Quick      Details ✦​ BRAND/ MANUFACTURER:SQUARE MANUFACTURER PART NUMBER:D8430 ADDITIONAL INFORMATION:Phase Failure Rela

MOORE Automation Ltd.

Career Center - Jobs: failure mode/mechanism distribution (5)

Director of Quality

Career Center | Houston, Texas USA | Engineering,Management,Production,Quality Control

Director of Quality - A large electro-mechanical manufacturing company in the Houston, Texas area currently has a Full-Time opening for a senior level Director of Quality. This is a direct hire position, reporting directly to the President of the c

CORESTAFF Services

Senior Process Engineer

Career Center | Appleton, Wisconsin USA | Engineering

Staff Process Engineer - Senior Job Title: Staff Process Engineer - Senior Purpose: Design, implement, and administer global manufacturing processes. Individuals may specialize in any or all of the following areas: Focus Factory Development, H

Fishpond Recruiting, Inc.

Career Center - Resumes: failure mode/mechanism distribution (9)

Jr. Technical Asst/Failure Analysis Technician

Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0

Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.

Jr. Technical Asst/ Failure Analysis Technicain

Career Center | Mariveles, Philippines | Engineering,Production,Quality Control

Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.

Express Newsletter: failure mode/mechanism distribution (325)

Partner Websites: failure mode/mechanism distribution (62)

Professional Development Courses | ICEET

Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm

. It is the role of the Failure Analysis team to establish the link between the failure mode and the failure mechanism. Once that link is understood, the path to the solution and the responsible party for it becomes clear

Surface Mount Technology Association (SMTA)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint

Heller 公司


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