Dyadem develops FMEA-Pro� 5, a revolutionary software tool that enables you to efficiently perform Failure Modes and Effects (FMEA) Analysis studies of manufactured products from the automotive, aerospace, defence and consumer electronics industries.
Failure analysis - Components as well as PC boards, Discretes, Passives ICs - offering X-ray. SEM/EDX -XRF - Cross sectioning complete root cause F/A
FMEA-Pro� 5 is a revolutionary software tool that enables you to perform a Failure Modes and Effects Analysis of manufactured products from the automotive, aerospace, defense and consumer electronics industries, to name just a few. This program is fu
FMEA-Pro� 5 is a revolutionary software tool that enables you to perform a Failure Modes and Effects Analysis of manufactured products from the automotive, aerospace, defense and consumer electronics industries, to name just a few. This program is fu
Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee
What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Used SMT Equipment | General Purpose Test & Measurement
The 371A , the industry leader in high power curve tracers is used for testing a wide variety of power semiconductors. It performs DC parametric characterization of thyristors, SCRs, IGBTs and power MOSFETs. The high voltage collector mode permits te
Used SMT Equipment | In-Circuit Testers
Anritsu S331E Anritsu S331E Sitemaster - Anritsu is pleased to introduce its eighth-generation compact handheld Site Master cable and antenna analyzer series with integrated spectrum analyzer. The new Site Master analyzers offer the same ease of
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Industry News | 2009-03-12 18:15:08.0
SMTA Boston will be held April 22-23, 2009 at the Boston Convention Center in conjunction with Electronics New England and NEPCON East.
Parts & Supplies | SMT Equipment
N610073252AA Main Body:NPM 1043889510AA ADJUST BOLT N610084824AA Label(Main Body):NPM N610073372AA Main Body (H):NPM N610073583AA CPU BOX & Wiring:NPM N610058919AM POWER UNIT:NPM N610087627AA Operation parts (H):NPM N610052923AA X-Axis:NP
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
PCB Surface Cleaning Machine MLPCM-450 Technical Parameters 1. Independent innovation patent design (patent: 2017SR471774), the industry's first, lets you have the most advanced contact cleaning system in the industry. 2. Using Panasonic PLC program
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Aug 20 00:00:00 EDT 2020 - Thu Aug 20 00:00:00 EDT 2020 | ,
Avoiding the Most Common PCB Failure Modes
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Delavan, Wisconsin USA | Production
*Set up printers, placement machines and reflow ovens for production. *Adjust machine parameters and CAM programs *Optimize part placement and feeder applications through CAM programs *Manipulate SPC data for solder paste height measrurements and int
Career Center | Tulsa, Oklahoma USA | Engineering
High tech Electronics manufacturing service EMS provider is looking for a Quality Engineer. Ideal candidate should have: Good background in EMS or contract electronics manufacturing (CEM) Desired experience in any of following - aerospace, defense
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
SMTnet Express, December 11, 2014, Subscribers: 23,586, Members: Companies: 14,135 , Users: 37,386 Failure Modes in Wire bonded and Flip Chip Packages Hikmat Chammas - Peregrine Semiconductor The growth of portable and wireless products is driving
SMTnet Express, February 19, 2015, Subscribers: 22,404, Members: Companies: 14,224, Users: 37,735 Numerical Study on New Pin Pull Test for Pad Cratering Of PCB Billy Hu, Jesus Tan - Flextronics Pad cratering is an important failure mode besides
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) is required due to machine failure, etc. The user of this mode is the highest level user, who can access all menus of the machine
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4600-automated-bondtester
. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion. Applications: Battery
