New Equipment | Test Equipment
This product is NEW. The DS6064 Digital Oscilloscope has 600 MHz Bandwidth and optional 1.5GHz bandwidth differential and single-ended active probes (model RP7150). These new products are designed and produced by RIGOL with many key technological b
Overview The DF6811 is a advanced 8-bit MCU IP Core with highly sophisticated, on chip peripheral capabilities. DF6811 soft core is binary-compatible with the industry standard 68HC11 8-bit microcontroller and can achieve a performance 45-100 milli
Electronics Forum | Tue Dec 21 12:28:11 EST 2021 | vtdivtecs
hey all, I had a comically bad failure yesterday while working with my pick and place, a part got dropped at exactly the wrong moment and flung a bracket up into the tool path, severely damaging the hydra controlboard that is next to the x camera. T
Electronics Forum | Fri Jul 21 12:15:52 EDT 2006 | CKH
Hi Folk, every now and then, i would encounter Functional Failure due to BGA ICs. The Testing Tech always conclude that the contact of the BGA to the PCB Pad is poor. The 2D/3D X-ray machine can't detect any of the poor contact on the BGA..... We
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Technical Library | 2012-12-14 14:28:20.0
This paper examines the potential failure mechanisms that can damage modern lowvoltage CMOS devices and their relationship to electrical testing. Failure mechanisms such as electrostatic discharge (ESD), CMOS latch-up, and transistor gate oxide degradation can occur as a result of electrical over-voltage stress (EOS). In this paper, EOS due to electrical testing is examined and an experiment is conducted using pulsed voltage waveforms corresponding to conditions encountered during in-circuit electrical testing. Experimental results indicate a correlation between amplitude and duration of the pulse waveform and device degradation due to one or more of the failure mechanisms.
Technical Library | 2021-10-12 18:08:28.0
Counterfeit components have been defined as a growing concern in recent years as demand increases for reducing costs. In fact the Department of Commerce has identified a 141% increase in the last three years alone. A counterfeit is any item that is not as it is represented with the intention to deceive its buyer or user. The misrepresentation is often driven by the known presence of defects or other inadequacies in regards to performance. Whether it is used for a commercial, medical or military application, a counterfeit component could cause catastrophic failure at a critical moment.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
SMTnet Express, April 29, 2021, Subscribers: 27,195, Companies: 11,344, Users: 26,617 Failure Analysis – Using Ion Chromatography And Ion Chromatography/Mass Spec (IC/MS) Since the 1980s the electronics industry has utilized ion
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. The flatness of the larger-sized PCB board cannot make the pins of all surface-mount components contact the pads. Even if the pins and pads can be in contact, the mechanical strength provided by it is often not large enough, and it is easy to be disconnected during the use of the product and become a point of failure. 4. Green lead-free
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Advanced-FPC-Real-Time-Controller-User-Guide-22940009.pdf
. Failure to provide guarding may result in injury or death. Turn off system before touching moving parts. WARNING: Final integration ‐ lock out tag procedure Lock out tag procedure for the final integrated system: Injury may occur if you fail to perform
