Industry Directory | Manufacturer
The most complete online source for Anti-Static, Anti-fatigue and Industrial matting needs.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions
Production Automation Corporation (PAC) is a distributor of products, tools and furniture for the electronics and medical device manufacturing industries.
HT172 ESD anti-fatigue mat 1,Size: 600*450*17mm,710*610*17mm,900*600*17mm,900*800*17mm, 8m*0.9m*17mm, 900*1500*15mm,400*600*15mm,etc... 2,Component: 1)Component 2 layer:Surface layer PVC+middle layer high elasticity composite cotton 2)Comp
For soldering to precious metals, thermal fatigue compliant, low temperature step soldering, lead free solutions available.
Electronics Forum | Thu Oct 26 03:20:13 EDT 2000 | heccles
What would be a typical thermal test regime to verify the quality of solder joints for high specification applications - what would be the specific benefits of utilizing a "HALT" process over other traditional test techniques ?
Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc
I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to
Used SMT Equipment | In-Circuit Testers
Custom Multiport Test Set, 75 Ohms The Agilent 87075B multiport test set dramatically reduces overall tune and test times because DUT only needs to be connected once to test multiple signal paths. Minimizing the number of connections also reduces o
Used SMT Equipment | In-Circuit Testers
Agilent 87075B Custom Multiport Test Set, 75 Ohms The Agilent 87075B multiport test set dramatically reduces overall tune and test times because DUT only needs to be connected once to test multiple signal paths. Minimizing the number of connect
Industry News | 2018-04-09 19:51:33.0
SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Parts & Supplies | Pick and Place/Feeders
Fuji NXT FEEDER calibration jig Fuji NXT FEEDER calibration jig for smt pick and place machine 1, the whole lean, simple, functional optimization . And the use of high-precision 0 gap guide, to ensure positional stability , greatly improve work e
Parts & Supplies | Pick and Place/Feeders
YAMAHA YS SMT FEEDER calibration jigs Product Information 1.The whole structure is streamlined, operating simply, functional optimization. And use the high-precision 0 gap rail, ensure location stability, greatly improve work efficiency. 2.Accur
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2014-07-10 17:37:18.0
This paper studies and compares the effects of pull–pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package.The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.
PLG series Computer Control Resonant High Frequency Fatigue Testing Machine Application： Electromagnetic resonance High-frequency fatigue testing machine has simple structure, convenient operation, high efficiency, low energy consumption and othe
Vision Mantis stereo inspection microscope viewer - What makes Mantis special
Events Calendar | Tue Mar 16 00:00:00 EDT 2021 - Tue Mar 16 00:00:00 EDT 2021 | ,
Webinar: A Happier YOU - Work Habits to Enhance Performance and Well-Being
Events Calendar | Tue Apr 07 00:00:00 EDT 2020 - Tue Apr 07 00:00:00 EDT 2020 | ,
Are You Considering Irregular Loading Cycles in Solder Interconnect Life Estimations?
Career Center | Lenexa, Kansas USA | Engineering
IM091891 - Senior Electronic/Electrical Design & Development Engineer - Wisconsin Excellent engineering management opportunity with a leading manufacturer of mobile construction equipment. The Senior Design & Development Engineer will lead the dev
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | , | Engineering,Maintenance,Management,Production,Technical Support
Having 10+years of Experience in manufacturing (SMT),Field Engineer Globally For Universal SMT Equipment .
SMTnet Express, July 10, 2014, Subscribers: 22902, Members: Companies: 13928, Users: 36450 Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads. Ren Huai-Hui, Wang Xi-Shu - Wind Power Engineer
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
