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With over 60 years of manufacturing excellence, we are one of the world's innovative and dynamic microscope manufacturers. Our products deliver unrivaled ergonomics for improved accuracy, repeatability, and productivity.
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DIstributor of Solderite Products. Soldering Stations featuring Patented Technology providing the most Rapid Temperature Recovery on the market today. Powerful systems designed for the rigors of Lead-Free Soldering. Electroplated Tips extending Life
New Equipment | Cleaning Equipment
QYSMT / MOREL PCB Surface Cleaning Machine SMM-450 Feature Improve quality ▶ Abnormal quality due to dust ▶The product is unqualified due to residual static electricity Improve efficiency ▶Improve printing quality ▶Improve SPI pass-through rate ▶I
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
Industry News | 2018-04-09 19:51:33.0
SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2014-07-23 17:19:28.0
IPC and Celestica announce that the IPC Pb-free Electronics Risk Management (PERM) Council is meeting in Toronto, Canada, July 22–24, to discuss lead-free conversion issues related to the safety, performance, reliability and affordability of electronics in the aerospace, defense, medical and other high-performance markets.
Technical Library | 2021-09-08 13:57:37.0
While the presence of silver in SAC solder provided excellent temperature cycling durability, the silver in high silver SAC alloy also made the solders susceptible to failures under drop/shock loading. To improve the drop/shock reliability, the silver content in SAC alloys was reduced from three percent, to as low as no silver. Solder dopants, also known as microalloy additions, are elements (typically 0.1% or lower) other than the main constituents of the alloy that have been shown to improve solder performance. Commonly used microalloy additions include nickel (Ni), bismuth (Bi), manganese (Mn), and antimony (Sb).
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
With the global industrial transformation, I.C.T entering Industry 4.0 intelligent MES system management helps customers improve production efficiency, shorten production cycle, and achieve comprehensive scientific traceability management, so as to q
QYSMT / MOREL PCB Surface Cleaning Machine SMM-450 Feature Improve quality ▶ Abnormal quality due to dust ▶The product is unqualified due to residual static electricity Improve efficiency ▶Improve printing quality ▶Improve SPI pass-through rate ▶I
Events Calendar | Mon Apr 06 18:30:00 UTC 2020 - Mon Apr 06 18:30:00 UTC 2020 | ,
Are You Considering Irregular Loading Cycles in Solder Interconnect Life Estimations?
SMTnet Express, December 27, 2019, Subscribers: 33,251, Companies: 10,949, Users: 25,451 A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism Credits: Beihang University PTH plays a critical role in PCB reliability. Thermal
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
performance under drop, shock and vibration loading conditions. Although SnAgCu (SAC) Pb-free solder alloys typically have better fatigue life than traditional eutectic SnPb solder, their fatigue reliability is limited at higher operating temperatures
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
failure. The failure mode remains solder fatigue, and the reduction in fatigue life is attributed to the geometric effect of reducing the crack path. These samples are two of the earliest failures in the 0/100 °C thermal cycling test, and it certainly is
