Industry Directory | Manufacturer / Other
With over 60 years of manufacturing excellence, we are one of the world's innovative and dynamic microscope manufacturers. Our products deliver unrivaled ergonomics for improved accuracy, repeatability, and productivity.
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
DIstributor of Solderite Products. Soldering Stations featuring Patented Technology providing the most Rapid Temperature Recovery on the market today. Powerful systems designed for the rigors of Lead-Free Soldering. Electroplated Tips extending Life
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
New Equipment | ESD Control Supplies
Plastlist ESD Rubber Table Mats ADVANTAGES: 1. Excellent vibration resistance and fatigue resistance; 2. Automatic adjustment of the force applied, to relieve the sense of fatigue. 3. Volume resistance ≤10-8ωcm, 4. 1.3m (Width)*10m (Length)
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen
I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew
Industry News | 2018-04-09 19:51:33.0
SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2014-07-23 17:19:28.0
IPC and Celestica announce that the IPC Pb-free Electronics Risk Management (PERM) Council is meeting in Toronto, Canada, July 22–24, to discuss lead-free conversion issues related to the safety, performance, reliability and affordability of electronics in the aerospace, defense, medical and other high-performance markets.
Parts & Supplies | Pick and Place/Feeders
Advantages of JUKI electric feeder With the electronic parts more sophisticated, more and more small, the use of electric feeder has become the standard placement of the placement machine, the old placement machine can use electric feeder has becom
Technical Library | 2014-08-28 17:09:23.0
The fastest growing package types in the electronics industry today are Bottom Termination Components (BTCs). While the advantages of BTCs are well documented, they pose significant reliability challenges to users. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies. This is especially true for new component packaging like BTCs. Obtaining relevant information can be difficult since information is often segmented and the focus is on design opportunities not on reliability risks (...)Commonly used conformal coating and potting processes have resulted in shortened fatigue life under thermal cycling conditions. Why do conformal coating and potting reduce fatigue life? This paper details work undertaken to understand the mechanisms underlying this reduction. Verification and determination of mechanical properties of some common materials are performed and highlighted. Recommendations for material selection and housing design are also given.
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Universal Chip Programming with Precision Socket Actuator Lever. Precision High Volume Production Manual Programmer– the 2900L is a multisite manual production programmer ideal for volumes from 1K to 500K+ per year. BPM’s 2900L is excellent for small
Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
Events Calendar | Tue Apr 07 00:00:00 EDT 2020 - Tue Apr 07 00:00:00 EDT 2020 | ,
Are You Considering Irregular Loading Cycles in Solder Interconnect Life Estimations?
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
SMTnet Express, December 27, 2019, Subscribers: 33,251, Companies: 10,949, Users: 25,451 A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism Credits: Beihang University PTH plays a critical role in PCB reliability. Thermal
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
performance under drop, shock and vibration loading conditions. Although SnAgCu (SAC) Pb-free solder alloys typically have better fatigue life than traditional eutectic SnPb solder, their fatigue reliability is limited at higher operating temperatures
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
failure. The failure mode remains solder fatigue, and the reduction in fatigue life is attributed to the geometric effect of reducing the crack path. These samples are two of the earliest failures in the 0/100 °C thermal cycling test, and it certainly is
