Industry Directory | Manufacturer
Semiconductor package substrate manufacturer, IC substrate manufacturer
1109 20GHz TDR Tester Product Classification: TDR Method Impedance Tester for High Speed, High Frequency Boards Product Description: The 1109 20GHz TDR Tester provides a test head equipped with dedicated high-frequency probes for TDR measurement w
New Equipment | Rework & Repair Services
Our shortest turnaround-Time for BGA Rework / Reballing Services is within 24 Hrs. We are capable of reworking precision complex components such as shown below:(1) Any type of land grid array package and/or socket, including PBGA, CBGA, CCGA, High I/
Electronics Forum | Thu Dec 06 15:27:36 EST 2012 | bmario
The package is flip chip BGA (FCBGA592) I found some info on leadless devices damages in IPC610 but it is not exactly what I am looking for.
Electronics Forum | Thu May 08 15:51:06 EDT 2008 | radab
Hi, I have some BGA devices, a plastic FCBGA memory chip (to be replaced) and an exposed-die FCBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with t
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Industry News | 2019-01-30 08:13:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Industry News | 2014-03-28 09:54:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.
Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
TI New and Original AM3871CCYE100 in Stock IC FCBGA-684 , 14+ package AM3871CCYE100 Sitara processor: Arm Cortex-A8, Ethernet Today's Hot Deals： TLK10232CTR FCBGA-144 TI 16+ DS90UB947TRGCRQ1 VQFN64 TI 22+ STP80NF10 TO-220 STM 19+ FF600R
TI New and Original TMS570LS0714APZQQ1 in Stock IC QFP , 18+ package TMS570LS0714APZQQ1 16/32-bit RISC Flash MCU, Arm Cortex-R4F, Q-100 Automotive Qualified Today's Hot Deals： TLK10232CTR FCBGA-144 TI 16+ DS90UB947TRGCRQ1 VQFN64 TI 22+ S
Events Calendar | Wed Sep 30 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Tempe, Arizona USA
EDPS 2020 Free Virtual Event Electronic Design Process Symposium (EDPS)
SMTnet Express March 14, 2013, Subscribers: 26245, Members: Companies: 13310, Users: 34436 Assembly and Reliability of 1704 I/O FCBGA and FPBGAs by: Reza Ghaffarian, Ph.D.; Jet Propulsion Laboratory, California Institute of Technology Commercial
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
