Industry Directory | Manufacturer
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
New Equipment | Solder Materials
FCT Assembly Fluxes are designed to be used with both SN100c and SAC305 alloys. By combining our latest flux tecnologies with SN100c, FCT Assembly has an advantage over all other suppliers in paste, wire and flux. FCT Assembly Flux Comparisons:
New Equipment | Solder Materials
FCT Solder manufactures a full line of leaded and lead-free solder products: Solder Wire and Bar Water Soluble Pastes Oil Water Soluble Water Washable Liquid Flux Rosin Pastes Rosin Liquid Flux Cleaners and Thinners N
Electronics Forum | Tue Feb 06 23:01:44 EST 2007 | Wayne
The QFN is found to have contact problem during FCT. The paste that I am currently using is SnPb 63/37 water soluble paste. Is it because of water soluble paste? (unable to clean after reflow process as QFN is entrapped by paste/flux) Should we use
Electronics Forum | Thu Apr 04 10:06:11 EDT 2019 | robl
Hi Vikram, Have you looked at the rotating flux buster style pins? A few people do them, but this is probably the best illustration: https://ingun.com/en/Products/ProductGroups/ICT_FCT/CategoryFolder/RotatingTestProbes We also find that the longer
Industry News | 2022-05-18 12:46:50.0
Committee Awards presented at IPC SummerCom 2022
Industry News | 2016-03-29 13:24:40.0
FCT Assembly (www.fctassembly.com), a leader in the development and manufacturing of high performance solders and advanced fluxes; has formulated a unique halogen-free water soluble flux with high activity and neutral pH. FCT’s 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys.
Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
SMTnet Express, March 5, 2015, Subscribers: 22,464, Members: Companies: 14,248, Users: 37,833 Conformal Coating over No Clean Flux Residues K.Seelig, T.O'Neill; AIM Solder As the proliferation of modern day electronics continues to drive
