Industry Directory | Manufacturer
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
Industry Directory | Manufacturer
Fine Line Stencil is committed to delivering the highest quality stencil technology in the industry.
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Fine Line Stencil is committed to delivering the highest quality laser stencils in the industry. SLIC™ Stencils Electroformed (ElectroLaser™) Stencils Advanced laser technology for your SMT stencil needs Squeegee Blades Buy FCT A
Electronics Forum | Fri Jan 10 14:49:20 EST 2020 | emeto
Steve I did investigate the transparent nano coat before for performance. We examined 3 different assemblies based in design criteria. In more simplistic designs it is not worth having it. On more challenging designs it is worth. It proved to have be
Electronics Forum | Fri Nov 13 11:02:46 EST 2009 | isd_jwendell
I use the LPKF model S. Operator uses a urethane(?) squeegee. Pressure and speed are controlled by the operator, which hasn't been a problem for me. The only problem I had was that I would forget to raise the PCB before I would start to squeegee the
Industry News | 2013-07-30 16:31:28.0
he SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 10, 2013 from 9:00 am until 3:30 pm.
Industry News | 2010-03-22 15:12:19.0
BANNOCKBURN, Ill, USA, March 19, 2010 — In a positive sign that economic recovery is on the upswing, more than 120 new products and services from companies in the electronics manufacturing industry will debut at IPC APEX EXPO™, April 6–8, 2010, at the Mandalay Bay Resort and Convention Center in Las Vegas.
Technical Library | 2018-10-03 20:41:44.0
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Career Center | Lapu-lapu, Cebu Philippines | Engineering,Maintenance,Production
Sept. 2, 2009 to Present, TPM2, LEAR Corporation, MEPZ-1, Lapu-Lapu City • Provides SMT engineering support to day-to-day manufacturing operations. • Handles SMT pick-and-place machine (Fuji, CP7, CP6 and QP242 Series, Universal Genesis GI-14D). •
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
