Industry Directory | Manufacturer
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
Industry Directory | Consultant / Service Provider / Manufacturer
Custom laser cutting services and precision parts manufacturing.
Fine Line Stencil is committed to delivering the highest quality laser stencils in the industry. SLIC™ Stencils Electroformed (ElectroLaser™) Stencils Advanced laser technology for your SMT stencil needs Squeegee Blades Buy FCT A
New Equipment | Solder Paste Stencils
BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precis
Electronics Forum | Fri Nov 13 11:02:46 EST 2009 | isd_jwendell
I use the LPKF model S. Operator uses a urethane(?) squeegee. Pressure and speed are controlled by the operator, which hasn't been a problem for me. The only problem I had was that I would forget to raise the PCB before I would start to squeegee the
Electronics Forum | Thu Sep 06 11:24:56 EDT 2018 | davef
pdf "BGA Stencil design guideline for avoid bridge" As you would expect, Google found 40,000+ results in less than a second One of my favorites was Power Point Presentation by Greg Smith [gsmithATfctassembly.com] at FCT Assembly: "Improve SMT Assem
Industry News | 2013-07-30 16:31:28.0
he SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 10, 2013 from 9:00 am until 3:30 pm.
Industry News | 2010-03-22 15:12:19.0
BANNOCKBURN, Ill, USA, March 19, 2010 — In a positive sign that economic recovery is on the upswing, more than 120 new products and services from companies in the electronics manufacturing industry will debut at IPC APEX EXPO™, April 6–8, 2010, at the Mandalay Bay Resort and Convention Center in Las Vegas.
Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Career Center | Lapu-lapu, Cebu Philippines | Engineering,Maintenance,Production
Sept. 2, 2009 to Present, TPM2, LEAR Corporation, MEPZ-1, Lapu-Lapu City • Provides SMT engineering support to day-to-day manufacturing operations. • Handles SMT pick-and-place machine (Fuji, CP7, CP6 and QP242 Series, Universal Genesis GI-14D). •
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
SMTnet Express, June 11, 2015, Subscribers: 22,861, Members: Companies: 14,392 , Users: 38,338 Solder Paste Stencil Design for Optimal QFN Yield and Reliability B. Gumpert; Lockheed Martin Corporation The use of bottom terminated components (BTC
