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Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
Electronics Forum | Tue Feb 20 16:56:36 EST 2001 | davef
There has been substantial amount of FEA done on predicting BGA ball reliability, but this has most often been applied to assessing the reliability of the design of products, rather than the effects of rework. This sounds like an interesting proje
Electronics Forum | Tue Jan 21 10:55:26 EST 2003 | MA/NY DDave
Hi From what you write no one here should have an answer since too little data is supplied. You might need to go to an FEA modelling shop to model the stresses and observe fatique life, or find a group to discuss your process and your application p
Industry News | 2018-02-26 10:51:50.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2018 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Industry News | 2006-06-20 14:29:49.0
Montreal - June 20, 2006
Parts & Supplies | SMT Equipment
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Technical Library | 2016-06-23 13:24:56.0
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
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Career Center | Lenexa, Kansas USA | Engineering
IM091891 - Senior Electronic/Electrical Design & Development Engineer - Wisconsin Excellent engineering management opportunity with a leading manufacturer of mobile construction equipment. The Senior Design & Development Engineer will lead the dev
Career Center | Houston, Texas USA | Engineering
Our South Houston client is looking to hire a Senior Mechanical Engineer on a direct hire basis. Job Summary: Perform the complete mechanical design required for both proprietary and non-proprietary projects. Assist with technical mechanical suppo
SMTnet Express, June 23, 2016, Subscribers: 25,290, Companies: 14,831, Users: 40,542 A Case Study on Evaluating Manual and Automated Heat Sink Assembly Using FEA and Testing Michael Sumalinog, Jesus Tan, Murad Kurwa; AEG, Flex (Flextronics
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
. Additional QFN components currently are under test and those results will be reported at a future date. Finite element analysis (FEA) has been incorporated into the program to aid in correlating the relationship between the package attributes, PCB properties and thickness, and cycles to failure in each of the test profiles. Key Words
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