New SMT Equipment: femto (3)

Fiber Laser

Fiber Laser

New Equipment |  

Aisin Seiki is expanding into new business areas such as femto second fiber laser and biotechnology related equipment. This creation of new values will promote new technologies and knowledge, which will be used in the manufacture of automotive compon

Aisin Electronics, Inc.

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

Used SMT Equipment: femto (1)

Agilent E5052B

Agilent E5052B

Used SMT Equipment | In-Circuit Testers

Key Features & Specifications Frequency range -  RF Input frequency range: 10 MHz to 7 GHz -  Analysis offset frequency range: 1 Hz to 100 MHz -  Phase noise measurement with ultra low noise floor and a cross-correlation method -  Frequency

Recon Test Equipment Inc.

Industry News: femto (5)

Laser Bar Bonding with AuSn or Indium on the New Automatic Sub-Micron Bonder FINEPLACER� FEMTO

Industry News | 2007-11-27 12:28:45.0

FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.

Finetech

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

Express Newsletter: femto (12)


femto searches for Companies, Equipment, Machines, Suppliers & Information

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