Industry Directory | Manufacturer
Manufacturer of Ferrite Chip Beads and Arrays, Ferrite Power Beads, Ceramic Inductors, and Ferrite Inductors.
Industry Directory | Manufacturer
SMD Chip Inductor, Chip Beads, Soft Ferrite Cores
Shape SMD Size Code (in mm) 0603 Size Code (in inch) 0201 Length 0.6mm Length Tolerance ±0.03mm Width 0.3mm Width Tolerance ±0.03mm Thickness 0.3mm Thickness Tolerance ±0.03mm Rated Current (at 85℃) 200mA Rated Current (at 125℃) 200mA Oper
Noise Suppression in Computers, Telecommunications, and consumer electronics.
Electronics Forum | Wed Oct 26 11:51:06 EDT 2005 | moonshine
Don't V score, unless you absolutely have concurrence with your QUALIFIED fab and assembly operations. Routing is best for all chip devices close to board edge. It's better and cleaner for everything when seeking quality and reliability. Visit htt
Electronics Forum | Wed Feb 05 11:38:46 EST 2003 | Stephen
Don't forget placement. I"ve seen chips broken when they are being placed because they were thicker than the parts data used for them. This is not an issue on Panasonic machines because they measure the thickness of parts but I have seen it happen
Used SMT Equipment | Pick and Place/Feeders
The unique mounting technology is embodied in: Advanced PCB collision detection No impact force = no component cracking Pressure control for placement of closed loop For small batch and multi-variety work orders, no need to disassemble FEEDER, the mo
Used SMT Equipment | Pick and Place/Feeders
The unique mounting technology is embodied in: Advanced PCB collision detection No impact force = no component cracking Pressure control for placement of closed loop For small batch and multi-variety work orders, no need to disassemble FEEDER, the mo
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
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Parts & Supplies | Assembly Accessories
00317958-03 PCB-SUPPORT 00317959-05 Y-CABLE-HOLDER 00317962-02 X-CABLE CLAMP 00317963-03 CONTACT METAL RIGHT SIDE 00317964-03 CONTACT METALL LEFT 00317969-09 MOUNT FOR APPLICATION HEAD SIPLACE 00317973-02&nbs
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Technical Library | 2022-09-25 20:03:37.0
Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed.
PCB V cut separator can cut both FR4 and aluminum PCB Speed is adjustable Small and portable for details,sales@jwide-smt.com
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/underfill-evolution
Get the Revisiting Underfill Handbook Without underfill, the life expectancy of a product would be significantly reduced due to the cracking of interconnects
