ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
Hanwha DECAN S1 Pick and Place Machine Speed: 47,000 CPH PCB Size : L510xW510 Feeder input:120pcs Weight: 1600KG Product description: Hanwha DECAN S1 Pick and Place Machine, Speed: 47,000 CPH, PCB Size : L510xW510, Feeder input:120pcs, Weight: 1600K
Electronics Forum | Wed Jun 09 13:11:29 EDT 1999 | John Thorup
| In past PCB designs I have cleared all traces from all layers | (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?
Electronics Forum | Thu Jun 03 06:14:38 EDT 2021 | bukas
Yes, most of my fiducials are 1 mm. BUT, you may consider going 1.5mm or even better 2 mm because in my experience PCB manufacturers will NOT check fiducial shape during PCB testing. This goes for fiducials that are placed on panel frame. Fiducilas t
Used SMT Equipment | Screen Printers
MPM-COOKSON, Serigraphic printing machine, type SPEEDLINE ULTRAPRINT 3000 - UP 3000/A, s.n. UO826/RF, with contrast support pins, online automatic frame cleaning (paper and solvent), double center camera 2D ( fiducial control 2D paste inspection), in
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Industry News | 2013-11-05 23:02:54.0
Nordson ASYMTEK will introduce the Spectrum™ II at Productronica this year, marking the 6-year anniversary of the introduction of the Spectrum series of high-speed, high-accuracy dispensing platforms. The Spectrum II S2-900 Series leverages the same small footprint of 600mm x 1321mm as the original Spectrum to provide maximum productivity with minimum manufacturing floor space, but improves the precision, accuracy, and speed of the system to rival much larger platforms.
Industry News | 2015-05-29 14:56:22.0
Nordson ASYMTEK earned two prestigious awards for innovative technology during NEPCON China 2015: the Innovation Award from Electronics Manufacturing (EM) Asia and the VISION Award from SMT China magazine. The awards were presented for achievement in product excellence in the dispensing equipment category for Nordson ASYMTEK's Quantum® automated fluid dispensing system. Nordson ASYMTEK products have received these awards for nine straight years.
Parts & Supplies | Circuit Board Assembly Products
1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting holes
Parts & Supplies | Other Equipment
We support Samsung Smt Machine spare parts for CP30,CP33,CP45,CP45NEO,CP60,CP55,CP10,CP11, SM321,SM320,SM411,SM421,SM431,SM471 etc machines nozzle, Feeder, CPU Board, IO Board, Laser, Cable, Feeder cart, Motor, Driver ect thanks CP30
Hello and thank you for your interest in our MPM SPM Semi-Automatic Stencil Printers For Sale. We have 2 systems available and both are in excellent condition. This listing below is for one of the printers. MPM - Speedline Technologies Model:
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/flexible-pcb-meet-flexible-dispensing
? Highly populated part carriers, many fiducials, and irregular dispense patterns that require multiple dual-axis and stop-and-go moves are common aspects that weigh heavily on flexible PCB dispensing UPH
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID.pdf
electrical test, thermal stress, panelization, laminate selection, scoring and routing parameters, board thickness tolerance, nonfunctional lands, hole aspect ratios, via hole size and printed board
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