technical parameter Model: s1200 (special type for LED light bar) Overall dimension (L × w × h): 1650 × 620 × 1550 (mm) Platform size: 320 × 1300 (mm) PCB size: 250 × 1250 (mm) Applicable template size: 550 ×
semi-automatic PCB solder paste printer mainly applying soldering paste, which is made of tin particles and flux, to the PCB board. And let the component be soldered. Main Features: 1.Apply to Korea roller high-speed gui
Electronics Forum | Wed Feb 24 12:53:55 EST 1999 | Dave F
| Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. | | Steve | Steve: �BGA�: Micro BGA�. A brand name for a fine pitch BGA from Tessera. Fine Pitch (1) In SMD: Surfa
Electronics Forum | Thu Mar 21 21:21:37 EST 2002 | davef
In the beginning, there was TO-5. And it was good. Flushed with success, they created TO-220. It too was good. Then came SMT. It was better than some things, but then again ... In these early days, there was a haze on the horizon that blocked t
Industry News | 2013-05-29 16:43:31.0
FCT Assembly today announced that its representative Production Automation Corp (PAC) closed a new solder paste account for FCT in Southern California.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS ChipPAC
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/eagle-issue-dont-know-what-to-edit_topic1117_post4415.html
. The test part Nick emailed me works fine so I may have something "set wrong"????? I have a directory set for parts to be saved and set out put for eagle
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
. Riemer INVERTED ACOUSTIC SYSTEMS CUT IBGT FAILURES As Published in Power Electronics Sept 2011 FLIP CHIP FAILURE MECHANISMS DETECTED WITH AMI As Presented at Pan Pac 2010 OPTIMIZING PROCESSES AND
