New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Fri Jan 14 11:39:32 EST 2000 | Jason Fang
Can anyone describe the different solder paste printing quality for fine pich by DEK265 and MPM2000 printer?
Electronics Forum | Fri Apr 15 13:25:40 EDT 2011 | tsvetan
agree, if you have fine pitch components the placement rate will be much less of what you see in the catalogues as they quote 0805 components placemen rate. I have one year log for one of our machine which is quoted to be 6400 cps and for one year a
SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
