Electronics Forum | Mon Dec 20 07:58:02 EST 1999 | pascal MATHIEU
hello guys ; we are using a fine pitch component(0.65mm) on a thick copper PCB (Cu = 90�m) ; in this case we notice that we are in the process'limits , because the different supplier of the PCB are not able to ensure a good stability of it's process
Electronics Forum | Thu Aug 20 13:01:40 EDT 2009 | bman
When I've seen white strands in the solder on SMT boards, it's been fibers from stencil wipes that stuck to the stencil, then transfered to the board when it was printed. I'm not sure why this would only happen with fine pitch components though.
Used SMT Equipment | Pick and Place/Feeders
FUJI QP341E-MM-FINE PITCH MOUNTER APR 2000 MFU: Has Qty 2 (No MTU) Nozzle Changer -16 positions Left to Right Board Flow Qty 2: Component Cameras Qty 1: PCB Fiducial Camera Voltage: 200v-220v 3 phase SMEMA Interface CE Marked Hours: 22,0
Used SMT Equipment | Pick and Place/Feeders
one stage machine Specifications SPEED from 2,000CPH MAX PCB 457 x 356 MM Component range 1005 to 74mm sq Speed: 2,000 up to 14,000 cph Modular multi-purpose machine Up to six modules BGAs, CSPs, CCGAs and QFP up to a max height of 25.4mm Accuracy: C
Industry News | 2013-06-26 09:09:19.0
The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.
Industry News | 2010-02-23 16:29:14.0
The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call for participation for the Fourth International Symposium on Tin Whiskers.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
Technical Library | 2013-04-18 16:46:42.0
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: to protect from moisture and contamination, to minimize dendritic growth, to provide stress relief, and for insulation resistance. These contribute to more durable handling, enhanced device reliability, and reduced warranty costs. Increased miniaturization of new circuit board designs requires flexible, low stress coating material to protect delicate components and fine-pitch leads. Silicone conformal coatings offer many advantages that address the general trend of ongoing PCBs designs, such as: high flexibility and low modulus to reduce stress on delicate or small components... First published in the 2012 IPC APEX EXPO technical conference proceedings.
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SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
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: Upon successfully completing this learning activity, learners will obtain and demonstrate the ability to: Identify the correct solder tip for the task Correctly place fine pitch Surface Mount components Create acceptable fine pitch Surface Mount solder connections to industry standards Inspect work for
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