Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer's Representative
Reseller of excellent electronic manufacturing equipment
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
New Equipment | Rework & Repair Equipment
These Made in America, Beau Tech RocHard MilProbes are the only complete line of probes available to meet the full spectrum of circuit repair, rework, and assembly needs from Through Hole to 2 mil pitch Surface Mount.
Electronics Forum | Thu Sep 07 18:32:51 EDT 2006 | vicknesh28
Yes the part is reworked. It solders when it's reworked.
Electronics Forum | Thu Sep 07 14:43:33 EDT 2006 | davef
Questions are: * So after you spot one of these leads sitting on a nice pillow of solder, what happens? * Do you rework the part? * Does it take solder? * What do you do to make it take solder, if it does take solder?
Used SMT Equipment | Pick and Place/Feeders
Mirae Corporation Quad Meridian - 1030P SMT Pick & Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: M3100-018 Features: 5 Nozzle Head 1 Gantry 4 Modular Heads 1 Precision Upward Precision Camera
Used SMT Equipment | Pick and Place/Feeders
Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Parts & Supplies | Soldering Equipment/Fluxes
Two-Piece Fine Pitch RocHard 10 MilProbe Kit
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Career Center | Warminster, Pennsylvania USA | Production,Quality Control
PCB component level assembly - soldering under microscope. *Soldering and mechanical assembly using excellent solder skills, manual dexterity, depth perception and attention to detail. *Perform or inspect component replacement and rework on units.
Career Center | Gwinnett County, Georgia USA | Production
SHIFTS: 1st and 2nd Shifts (Over-Time as required) STATUS: Indefinite Temporary PAY: $11.00-$12.00 per hour JOB DESCRIPTION • Perform SMT soldering, desoldering, rework, and assembly of fine pitch electronic components on Printed Circuit Boards (PCB
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/xpf-l-fuji-xpf-l-fine-pitch-placer-217430?page=155
FUJI FUJI XPF-L Fine Pitch Placer XPF-L | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products FUJI XPF-L Fine Pitch Placer Public Pricelist Public
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Yue Deng1,*, Xike Zhao2
