Leading supplier of Solid Solder Deposit (SSD) technology and equipment to the electronics industry. Mask Tek's patented PPT process eliminates solder paste at assembly. Ideal for fine pitch and BGAs. Please visit our web site at masktek.com.
Industry Directory | Consultant / Service Provider / Manufacturer
Our Ultrasonic Stencil cleaners and 440-R-SMT Detergent are US & CA EPA Certified cleaners, that are environmentally and user safe. We are your single source for cleaning any type of solder paste from any fine pitch stencil.
New Equipment | Soldering Robots
Electronic Bonding Equipment Soldering for FFC HSC FPC to PCB Features: 1. Customized based on the connector; 2. Double jig welding; 3. Double- desk working mode; 4. Can achieve ultra-fine pitch welding; 5. Applicable to welding the cable and
New Equipment | Solder Paste Stencils
SMT Framed Stencils are laser cut solder paste stencils designed to work on SMT printing machines. These laser cut stencils are permanently glued into a frame. These framed stencils are are designed for highly repeatable continuous operation in volum
Electronics Forum | Thu Jan 03 02:26:12 EST 2002 | arzu
Hello, I need to know the volume spread of solderpaste after screenprinting fine-pitch paste using a nickelformed screen. It is the end-result that counts , so of course the spread of metalcontent in the paste is important too. Can anyone tell me som
Electronics Forum | Mon Dec 16 13:24:25 EST 2002 | Stephen
What paste are you using?
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Industry News | 2013-08-01 13:16:42.0
The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 17, 2013 as a focused symposium at SMTA International in Fort Worth, TX.
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Parts & Supplies | Pick and Place/Feeders
Expert-SAFP (110V/230V configurable) NEW PRICE EUR30.000,-, now for EUR 18.500 net (excl. Tax) only. Perfect for fast and reliable Prototyping. For sale is an Essemtec Expert-SAFP (110V/230V configurable). The Expert-SAFP is a professinal semi-
Technical Library | 2015-08-06 19:17:53.0
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself, traditionally the source of 70% of all assembly defects, finds its process window narrowing. The technology of metal blade squeegees, with the aid of new materials, understanding, and settings such as blade angle, has kept pace with all but the smallest applications, e.g., 200μ - .50 AR and 150μ - .375 AR, which have been pushing blade printing technology to its limits. Enclosed media print head technology has existed, and has been under increasing development, as an alternative to metal squeegee blade printing. Until recently, the performance of enclosed print heads had been comparable to the very best metal squeegees, but advances in enclosed print media technology have now made it a superior alternative to squeegee blades in virtually all applications.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
SMT is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology. SMT production line is also called surface assembly technology. Full-auto SMT Production Line is a new generat
This is video shows how to print a PCB using a prototype foil only stencil. The SMT prototype stencil (www.soldertools.net) is made from a high nickel content material able to offer repeatable high precision apertures. The steps of alignment, printin
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Gwinnett County, Georgia USA | Production
SHIFTS: 1st and 2nd Shifts (Over-Time as required) STATUS: Indefinite Temporary PAY: $11.00-$12.00 per hour JOB DESCRIPTION • Perform SMT soldering, desoldering, rework, and assembly of fine pitch electronic components on Printed Circuit Boards (PCB
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/xpf-l-fuji-xpf-l-fine-pitch-placer-217430?page=155
FUJI FUJI XPF-L Fine Pitch Placer XPF-L | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products FUJI XPF-L Fine Pitch Placer Public Pricelist Public
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Yue Deng1,*, Xike Zhao2
