New Equipment | Fabrication Services
Gold Finger PCB No of layer: 6 layer Material: FR-4, TG170 Thickness: 1.6mm Copper thickness: 35um copper/1oz Yellow Solder Mask Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um Special technology: gold finger/Edge connector plating, go
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
Electronics Forum | Mon Feb 05 20:43:27 EST 2001 | davef
1 Solder on gold fingers comes from: 1a About 70 % of the time it's caused by poor cleaning of screen printer, staging area (table), conveyor, reflow oven chain or belt, and keeping boards separate from cleaning process 1b After loading paste onto
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
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Parts & Supplies | Pick and Place/Feeders
Universal AI part 255488000 mirror Other Universal AI parts in stock: 1 30952105 ACTUATOR 2 30952306 BLOCK 3 30952602 HOUSING 4 3095280
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Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection softwa
Career Center | Baguio City, Philippines Philippines | Engineering
Responsible to effectively utilize all of the available resources such as machines, materials, manpower and methods in order meet the Offsite metric goal according to the customers’ specifications, requirements and needs; Responsible for evalua
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
; single-spaced Text fully justified (no ragged right edge) Block paragraphs (no indents) Omit page numbers - they will be inserted electronically Key words
