Industry Directory | Manufacturer
Tough devices for tough environments. Rugged Science offers multiple solutions for any industry with our embedded devices.
Industry Directory | Manufacturer
Invensas is focused on the development of cutting-edge enabling technologies in advanced semiconductor packaging for advanced mobility and storage products.
CFDRC's flagship software product. It consists of: CFD-GEOM (for geometry and grid generation), CFD-ACE and CFD-ACE(U) (pressure-based, finite-volume flow solvers for multiblock structured and unstructured hybrid grids) and CFD-VIEW (for post process
Density Based, Finite-Volume code, for high-speed flow solutions. It employs all major gridding techniques, including automated Chimera for multiple and moving body applications. It also has a coupled 6-DOF and prescribed motion models.
Electronics Forum | Tue Feb 20 10:47:19 EST 2001 | Massimo
Hi everybody, I need to collect some documentation about BGA rework, in particular I wolud like to know if there are some "theoretical" studies about this matter (for example a finite element model of a BGA suitable to be used to simulate BGA reflow)
Electronics Forum | Mon Dec 01 15:16:58 EST 2003 | davef
So, you need to know how these reductions in solder volume will perform in real life. In-use of the product in the life environment is the surest test. Many companies can�t wait / don�t want to pay for that information. * Some use accelerated life
Industry News | 2014-09-18 17:55:32.0
SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2018-01-15 13:37:11.0
The SMTA is pleased to announce the Best Papers from SMTA International 2017. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Technical Library | 2021-08-11 00:57:57.0
This paper shows the Design and Finite Element analysis of vacuum chamber of potting machine designed for electronic ignition coil applications. There are two types of potting methods 1) With Vacuum 2) Without Vacuum.
Technical Library | 2012-01-12 22:51:19.0
In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSCS(GPA 3.0 or higher), 0-5 years experience in at least 1 of the following: Embedded Systems, PSost, Unix, C/C++, Pascal; knowledgeable of data structures, real-time operating systems, finite state systems, programming in a st
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/industrial-coating-systems/application-solutions/uv-curing/wire-cable-and-optical-fiber
e forza per la produzione di fili e cavi. Nella produzione di fibra ottica, questi vantaggi sono ancora più significativi quando vengono applicati inchiostri con essiccazione UV alle fibre finite per scopi di codifica tramite colore e identificazione, nonché
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. This is usually done through finite element analysis. Solder joint modeling must be performed at different levels to take into consideration all aspects of solder joint reliability
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