Industry Directory | Manufacturer
Tough devices for tough environments. Rugged Science offers multiple solutions for any industry with our embedded devices.
Industry Directory | Manufacturer / Other
Established in 2000, Focus CNC Co., Ltd. provides series of CNC Lathe Machinery, CNC lathe, live tool CNC lathe, mill turn lathe and CNC turning machine. Please visit our website to get more details.
NCI uses the latest generation PCs, with standard office software (including spreadsheet, database, program management and word-processing software) for normal office operations and program control. We (and our consultants) use Pro-E engineering and
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
Electronics Forum | Thu Mar 01 23:15:28 EST 2007 | jmelson
You shouldn't be worrying about "impedance" on a DC relay. Just measure the resistance with a Voltmeter/Ohmmeter. If you need to know the current draw, it will be 24/resistance The impedance of an AC relay changes as the armature moves from the "off
Electronics Forum | Sun May 17 13:46:30 EDT 1998 | Steve Gregory
Hi All! I've been reading this conversation which prompted me to break out the IPC-SM-786A from the IPC manuals from our parent company in Maryland sent us (we're just starting up in California). It's the Procedures for Characterizing and Handling of
Used SMT Equipment | In-Circuit Testers
JDSU FireBerd 8000-CFB8000-02-C2000-V6 Communications Analyzer JDSU FB8000 The FIREBERD 8000 combines the success of two highly successful test platforms - the FIREBERD 6000A and the TestPad. As a datacom analysis module for the TestPad, the por
Used SMT Equipment | In-Circuit Testers
JDSU FireBerd 8000-CFB8000-02-C2000-V6 Communications Analyzer JDSU FB8000 The FIREBERD 8000 combines the success of two highly successful test platforms - the FIREBERD 6000A and the TestPad. As a datacom analysis module for the TestPad, the por
Industry News | 2003-02-13 08:11:45.0
eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%
Industry News | 2003-07-03 08:45:09.0
Leading Electronic Manufacturing Service Provider Leverages Tradec Solution to Manage Commodity Cost and Accelerate the Quotation Process
Technical Library | 2021-08-11 00:57:57.0
This paper shows the Design and Finite Element analysis of vacuum chamber of potting machine designed for electronic ignition coil applications. There are two types of potting methods 1) With Vacuum 2) Without Vacuum.
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSCS(GPA 3.0 or higher), 0-5 years experience in at least 1 of the following: Embedded Systems, PSost, Unix, C/C++, Pascal; knowledgeable of data structures, real-time operating systems, finite state systems, programming in a st
Career Center | San Diego, California USA | Engineering
Kodak - A Design & Product Testing Engineer is responsible for oversight of ink jet printer projects being conducted by the Testing and Customer Assurance area. Oversight includes assurance of the data integrity as well as effective collection, redu
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. This is usually done through finite element analysis. Solder joint modeling must be performed at different levels to take into consideration all aspects of solder joint reliability
| https://www.eptac.com/faqs/ask-helena-leo/ask/multiple-wash-steps-affecting-resistance-characteristics
. Many reasons could cause this issue, so my suggestion would be to have the component sent to a lab for surface analysis to determine whether or not the problem is contamination or deterioration of the resistive element
