Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
Valor MSS seamlessly integrates the entire PCB manufacturing process with one easy-to-manage platform. Available as an end-to-end suite, each of the following modules may also be installed separately. One platform supports your entire manufacturing
Electronics Forum | Fri Jun 29 12:47:25 EDT 2012 | deanm
We are experiencing widely varying First Pass Yields for selective soldering. Some boards are near 100% while others are less than 50% depending on the pitch and general complexity of the board. Question: If you are running 100 boards through your s
Electronics Forum | Thu Jan 10 17:20:25 EST 2002 | Matt Kehoe
Dont forget, if you dont want to print paste and deal with the challenges of placing components in wet paste, solid solder deposit can save you the cost of the stencil printer, while offering better first pass yields than traditional methods. It just
Industry News | 2017-10-05 05:41:24.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2017 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.
Industry News | 2018-07-11 20:37:51.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2018 is now available. The global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
Technical Library | 2010-03-04 18:11:53.0
While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
to Front Page Solder Paste Measurement: A Yield Improvem
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.mdb where xxx is the Windows user login name when the software was installed. Click OK. We will use this cells32.mdb database for the tutorial and to aid in creating your first routing. (Note3
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: Achieve a production ready first pass yield Dynamic Production Editing means no tape boards required – no waste Simple, menu-driven process for new users Get products into production quickly, efficiently, and effectively Create and tune feeder, placement, fiducial, and component information quickly
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