New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
Electronics Forum | Thu Feb 18 17:35:43 EST 2010 | haider
What do we need to fix in the profile if we have voids in BGAs?
Electronics Forum | Mon Feb 22 16:24:52 EST 2010 | blnorman
Depends on how much voiding you have as well. 25% is allowable.
Industry News | 2014-07-06 12:48:55.0
If you have problems with voids in area array packages or bubbles in conformal coating? Lets fix these together in September at SMTA International. There are many different reasons why some defects occur so lets look at the common reasons and see which is your best solution.
Industry News | 2016-10-17 18:55:57.0
KIC today announced plans to exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, Nov. 17, 2016 at the Melbourne Auditorium in FL. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding” at 11 a.m.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. Circuit board preparation - masking, baking and other process steps. BGA site preparation. Solder mask breakdown - how to prevent it, how to fix it
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/0402-capacitors-under-1-mm-pitch-bga_topic695_post2385.html
and ready for reflow with BGA fanout on one side and capacitor pad on the other side. With capacitors, a small "dimple" (with trapped air) in the pad would not create a void cavity in the lead like they do in BGA via-in-pad
