Industry Directory | Consultant / Service Provider
Assembly pallets, tooling, & Engineering Services.
In-circuit Test Fixtures, Custom Pallets, Functional Test Jigs
New Equipment | Cleaning Equipment
Introduction The equipment is suitable for all kinds of the outer surface of the workpiece cleaning, such as wave soldering jig, reflow soldering tray, condenser cleaning, printing scraper, machine parts surface flux, clean oil, dust etc. Integrated
New Equipment | Board Handling - Pallets,Carriers,Fixtures
SMT / PCB FIXTURES & TOOLING SMT PROCESS CARRIERS, WAVE SOLDER PALLETS, CONFORMAL COAT FIXTURES, PRESS FIT SUPPORT FIXTURES, REFLOW FIXTURES, SELECTIVE SOLDER FIXTURES, SURFACE MOUNT CARRIERS, AUTO INSERTION FIXTURES, WORKBOARD HOLDERS DEDICATED AND
Electronics Forum | Mon Dec 03 20:12:41 EST 2001 | Kelvin Kok
Hi Peterson, We are in the business of manufacturing wave, SMT pallets and all kinds of toolings. With our 11 years expertise, we definitely able to meet your requirements with quality products. With our location in Silicon valley and supporting ma
Electronics Forum | Thu Feb 23 10:19:29 EST 2006 | Hiram
Hi John, I have used some wave fixtures with titanium inserts. I ordered from Pentagon EMS (503)924-2747... Turnaround time and quality are excellent. Regards, Hiram
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2001-02-12 16:51:46.0
Opti-Flux II spray fluxing system from Ultrasonic Systems (USI) is now capable of automated, in-line selective fluxing. The operator can now apply flux to selected areas of the board or pallet fixture. The system automatically identifies the type of board by bar code, which is associated with a recipe previously entered into the menu by the operator.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
World’s first water-based cleaning agent for the removal of conformal coating material from pallets, fixtures, and tools ATRON® DC is engineered specifically for maximum decoating power while prioritizing the highest level of operator safety. It is
MB-Mfg's pallet in use.
Career Center | Milwaukee, Wisconsin USA | Engineering
Cree Lighting, A company of IDEAL INDUSTRIES, is an LED lighting pioneer known for being first – first to bring LED lighting to the masses, first to deliver no compromise white light, and first to offer a sensor-integrated intelligent lighting
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
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