Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
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Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
Electronics Forum | Mon Aug 16 11:49:44 EDT 2004 | Kris
Hi Guys thanks for the replies. Dave, the spec is not for enig but for hard gold does your response alter if thats the case /
Electronics Forum | Mon Aug 16 16:26:19 EDT 2004 | Kris
what about areas that are soldered ? This is def not a Enig process and the specs are as they are not sure why thanks a lot for your help
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. The solubility of nickel in the indium is very low so diffusion-controlled growth of the intermetallic (IMC) layer is slow. On exposure to air, nickel forms a unsolderable oxide on its surface, so it is protected with a flash coating of gold. In
