Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.
High Tech, Quick Turn, Manufacturer of PCB's up to 44 layer count. Specializing in Prototype and R&D. Mil-Spec 31032 & 55110 Certified. Located in Fremont, CA & Amesbury, MA.
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Electronics Forum | Thu Aug 12 14:59:50 EDT 2004 | davef
Russ: Immersion gold [imm Au] is "soft" and it's "gold", but it is NOT "soft gold". Here's the question for your board house: If imm Au is "soft gold" and imm Au self-limits
Electronics Forum | Thu Aug 12 14:50:12 EDT 2004 | russ
This is interesting, I was once told by a PCB supplier that "soft gold" was immersion and the "hard gold" was the plated. But I agree with Dave F., Chris, what's going on? Russ
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. The solubility of nickel in the indium is very low so diffusion-controlled growth of the intermetallic (IMC) layer is slow. On exposure to air, nickel forms a unsolderable oxide on its surface, so it is protected with a flash coating of gold. In
